by Song, Changhwan, Kim, Jihyun, Cho, Jungwan
Published in International journal of heat and mass transfer (01.09.2020)

by Yoonjin Won, Jungwan Cho, Agonafer, Damena, Asheghi, Mehdi, Goodson, Kenneth E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2015)

by Jungwan Cho, Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., Goodson, K. E.
Published in IEEE electron device letters (01.03.2012)

by Park, Woosung, Romano, Giuseppe, Ahn, Ethan C., Kodama, Takashi, Park, Joonsuk, Barako, Michael T., Sohn, Joon, Kim, Soo Jin, Cho, Jungwan, Marconnet, Amy M., Asheghi, Mehdi, Kolpak, Alexie M., Goodson, Kenneth E.
Published in Scientific reports (24.07.2017)

by Jungwan Cho, Zijian Li, Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2013)

by Yoonjin Won, Jungwan Cho, Agonafer, Damena, Asheghi, Mehdi, Goodson, Kenneth E.
Published in 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2013)

by Park, Woosung, Kodama, Takashi, Park, Joonsuk, Cho, Jungwan, Sood, Aditya, Barako, Michael T, Asheghi, Mehdi, Goodson, Kenneth E
Published in ACS applied materials & interfaces (06.09.2017)

by Jungwan Cho, Yoonjin Won, Francis, Daniel, Asheghi, Mehdi, Goodson, Kenneth E.
Published in 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2014)

by Yates, Luke, Sood, Aditya, Zhe Cheng, Bougher, Thomas, Malcolm, Kirkland, Jungwan Cho, Asheghi, Mehdi, Goodson, Kenneth, Goorsky, Mark, Faili, Firooz, Twitchen, Daniel J., Graham, Samuel
Published in 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2016)

by Jungwan Cho, Zijian Li, Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)

by Cho, Jungwan
Published in Nanoscale and microscale thermophysical engineering (02.01.2018)

by Kim, Jihyun, Cho, Jungwan
Published in Energy conversion and management (01.01.2019)

by Jungwan Cho, Yiyang Li, Altman, D. H., Hoke, W. E., Asheghi, M., Goodson, K. E.
Published in 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) (01.10.2012)

by Cho, Jungwan, Park, Joonsuk, An, Jihwan
Published in Journal of the European Ceramic Society (01.08.2017)

by Cho, Jungwan, Goodson, Kenneth E
Published in Nature materials (01.02.2015)

by Baek, Jongwon, Bae, Junyoung, Hori, Takuma, Cho, Jungwan
Published in International communications in heat and mass transfer (01.08.2024)

by Kong, Daeyoung, Kang, Minsoo, Kim, Kyung Yeun, Jang, Jina, Cho, Jungwan, In, Jung Bin, Lee, Hyoungsoon
Published in ACS applied materials & interfaces (19.08.2020)

by Kim, Dong-Min, Choi, Sinwoo, Cho, Jungwan, Lim, Mikyung, Lee, Bong Jae
Published in Physical review letters (28.04.2023)

by Kim, Taehun, Kim, Seongkyun, Kim, Eungchul, Kim, Taesung, Cho, Jungwan, Song, Changsik, Baik, Seunghyun
Published in Small (Weinheim an der Bergstrasse, Germany) (01.09.2021)

by Song, Changhwan, Kim, Jihyun, Lee, Hyoungsoon, Cho, Jungwan
Published in Solid state communications (01.06.2019)