Passively assembled optical interconnection system based on an optical printed-circuit board
Sung Hwan Hwang, Sung Hwan Hwang, Mu Hee Cho, Mu Hee Cho, Sae-Kyoung Kang, Sae-Kyoung Kang, Hyo-Hoon Park, Hyo-Hoon Park, Han Seo Cho, Han Seo Cho, Sang-Hoon Kim, Sang-Hoon Kim, Kyoung-Up Shin, Kyoung-Up Shin, Sang-Won Ha, Sang-Won Ha
Published in IEEE photonics technology letters (01.03.2006)
Published in IEEE photonics technology letters (01.03.2006)
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Journal Article
High-coupling-efficiency optical interconnection using a 90°-bent fiber array connector in optical printed circuit boards
Mu Hee Cho, Mu Hee Cho, Sung Hwan Hwang, Sung Hwan Hwang, Han Seo Cho, Han Seo Cho, Hyo-Hoon Park, Hyo-Hoon Park
Published in IEEE photonics technology letters (01.03.2005)
Published in IEEE photonics technology letters (01.03.2005)
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Journal Article
VCSEL array module using (111) facet mirrors of a V-grooved silicon optical bench and angled fibers
Sung Hwan Hwang, Sung Hwan Hwang, Jae Yong An, Jae Yong An, Myeong-Hyun Kim, Myeong-Hyun Kim, Woo Chang Choi, Woo Chang Choi, Sung Ryul Cho, Sung Ryul Cho, Sang Hwan Lee, Sang Hwan Lee, Han Seo Cho, Han Seo Cho, Hyo-Hoon Park, Hyo-Hoon Park
Published in IEEE photonics technology letters (01.02.2005)
Published in IEEE photonics technology letters (01.02.2005)
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Journal Article
Highly reliable processes for embedding discrete passive components into organic substrates
Cho, Han Seo, Cho, Sukhyeon, Jo, Jihong, Seo, Haenam, Kim, Byongmoon, Yoo, Jegwang
Published in Microelectronics and reliability (01.05.2008)
Published in Microelectronics and reliability (01.05.2008)
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Journal Article
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps
Chu, K.-M., Lee, J.-S., Cho, H.S., Park, H.-H., Jeon, D.Y.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2004)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2004)
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Journal Article
Conference Proceeding
Parallel optical transmitter module using angled fibers and a V-grooved silicon optical bench for VCSEL array
SUNG HWAN HWANG, DAE DONG SEO, JAE YONG AN, KIM, Myeong-Hyun, WOO CHANG CHOI, SUNG RYUL CHO, SANG HWAN LEE, PARK, Hyo-Hoon, HAN SEO CHO
Published in IEEE transactions on advanced packaging (01.08.2006)
Published in IEEE transactions on advanced packaging (01.08.2006)
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Journal Article
Conventional Printed Circuit Board Technology Approach for an Electro-Optical Layer
Cho, Han Seo, Kim, Sang-Hoon, Kim, Joon-Sung, Jung, Jaehyun
Published in Japanese Journal of Applied Physics (01.06.2009)
Published in Japanese Journal of Applied Physics (01.06.2009)
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Journal Article
Compact packaging of optical and electronic components for on-board optical interconnects
HAN SEO CHO, CHU, Kun-Mo, KANG, Saekyoung, SUNG HWAN HWANG, BYUNG SUP RHO, WEON HYO KIM, KIM, Joon-Sung, KIM, Jang-Joo, PARK, Hyo-Hoon
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
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Journal Article
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications
Chu, K.-M., Choi, J.-H., Lee, J.-S., Cho, H.S., Park, S.-O., Park, H.-H., Jeon, D.Y.
Published in IEEE transactions on advanced packaging (01.08.2006)
Published in IEEE transactions on advanced packaging (01.08.2006)
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Journal Article
Optical interconnection using fiber-embedded boards and connection blocks fabricated by a micro-grooving technique for fiber insertion
Cho, Han Seo, Kang, Saekyoung, Cho, Mu Hee, Rho, Byung Sup, Park, Hyo-Hoon, Shin, Kyoung Up, Ha, Sang-Won, Rhee, Byoung-Ho, Kim, Dong-Su, Jung, Sun Tea, Kim, Taeil
Published in Journal of micromechanics and microengineering (01.08.2004)
Published in Journal of micromechanics and microengineering (01.08.2004)
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Journal Article