Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer
Hong, Zhong-Jie, Liu, Demin, Hu, Han-Wen, Cho, Chih-I, Weng, Ming-Wei, Liu, Jui-Han, Chen, Kuan-Neng
Published in Applied surface science (01.08.2022)
Published in Applied surface science (01.08.2022)
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Journal Article
Investigation of bonding mechanism for low-temperature CuCu bonding with passivation layer
Hong, Zhong-Jie, Liu, Demin, Hu, Han-Wen, Cho, Chih-I, Weng, Ming-Wei, Liu, Jui-Han, Chen, Kuan-Neng
Published in Applied surface science (01.08.2022)
Published in Applied surface science (01.08.2022)
Get full text
Journal Article
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Hong, Zhong-Jie, Liu, Demin, Hu, Han-Wen, Hsiung, Chien-Kang, Cho, Chih-I, Chen, Chih-Han, Liu, Jui-Han, Weng, Ming-Wei, Hsu, Mu-Ping, Hung, Ying-Chan, Chen, Kuan-Neng
Published in Applied surface science (01.02.2023)
Published in Applied surface science (01.02.2023)
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Journal Article
Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging
Hong, Zhong-Jie, Liu, Demin, Hsieh, Shu-Ting, Hu, Han-Wen, Weng, Ming-Wei, Cho, Chih-I, Liu, Jui-Han, Chen, Kuan-Neng
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUTTERING TARGET MAKING THE SAME, SEMICONDUCTOR BONDING STRUCTURE AND SEMICONDUCTOR BONDING PROCESS
HONG, Zhong-Jie, HSIEH, CHENG-YEN, WENG, Ming-Wei, CHEN, Chih-Han, CHO, Chih-I, WU, Hong-Yi, CHEN, Kuan-Neng, WANG, Chiao-Yen, HUNG, Ying-Chan
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
Patent
Passivation layer for forming semiconductor bonding structure, sputtering target making the same, semiconductor bonding structure and semiconductor bonding process
CHEN, CHIH-HAN, WU, HONG-YI, HSIEH, CHENG-YEN, HONG, ZHONG-JIE, WENG, MING-WEI, CHEN, KUAN-NENG, HUNG, YINGAN, CHO, CHIH-I, WANG, CHIAO-YEN
Year of Publication 16.05.2024
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Year of Publication 16.05.2024
Patent
Passivation layer for forming semiconductor bonding structure, sputtering target making the same, semiconductor bonding structure and semiconductor bonding process
CHEN, CHIH-HAN, WU, HONG-YI, HSIEH, CHENG-YEN, HONG, ZHONG-JIE, WENG, MING-WEI, CHEN, KUAN-NENG, HUNG, YINGAN, CHO, CHIH-I, WANG, CHIAO-YEN
Year of Publication 11.05.2024
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Year of Publication 11.05.2024
Patent