Nanotextured and polytetrafluoroethylene-coated superhydrophobic surface
Lee, Dongin, Seo, Sung-Bo, Kim, Dong-Young, Kim, Hwa-Min, Cho, Chanseob, Lee, Jonghyun, Lim, Sooyeon, Kim, Jinseok, Lee, Byeungleul, Kim, Bonghwan
Published in Thin solid films (29.11.2013)
Published in Thin solid films (29.11.2013)
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Journal Article
Conference Proceeding
Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools
ChanSeob Cho, Taylor, Ron, Mungmode, Ashish, Dongsheng Fan, Spivak, Dmitry, Camp, Janay, Hong Xiao
Published in 2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2015)
Published in 2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2015)
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Conference Proceeding
Nano-size structure formation on Si substrate for optical device application
DaeYoung Kong, JungHwa Oh, BongHwan Kim, ChanSeob Cho, JongHyun Lee
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Fabrication of superhydrophobic surface using surface texturing with nano-sized structure and PTFE film
JungHwa Oh, DaeYoung Kong, SungBo Seo, DongYoung Kim, HwaMin Kim, ChanSeob Cho, JongHyun Lee, Bonghwan Kim
Published in 2012 IEEE Sensors (01.10.2012)
Published in 2012 IEEE Sensors (01.10.2012)
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Conference Proceeding
Fabrication of BeCu module probe array using heating and fusing currents
Dongin Lee, Sangwon Kim, Daeyoung Kong, Chanseob Cho, Bonghwan Kim, Byeungleul Lee, Jonghyun Lee
Published in 2011 IEEE SENSORS Proceedings (01.10.2011)
Published in 2011 IEEE SENSORS Proceedings (01.10.2011)
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Conference Proceeding
Design and fabrication of MEMS test socket for BGA IC packages
Sangwon Kim, Daeyoung Kong, Chanseob Cho, Jaewoo Nam, Bonghwan Kim, Jonghyun Lee
Published in 2010 IEEE Sensors (01.11.2010)
Published in 2010 IEEE Sensors (01.11.2010)
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Conference Proceeding
Four-electrode micropump with peristaltic motion
Lee, Insoo, Hong, Pyohwan, Cho, Chanseob, Lee, Byeungleul, Chun, Kyunghan, Kim, Bonghwan
Published in Sensors and actuators. A. Physical. (01.07.2016)
Published in Sensors and actuators. A. Physical. (01.07.2016)
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Journal Article
Nanoporous Ag Films Prepared by Cluster‐Source Sputtering as Substrates for Surface‐Enhanced Raman Scattering
Yun, Sungho, Lee, Junyeop, Yang, Jaemoon, Lee, Dongin, Kim, Bonghwan, Cho, Chanseob
Published in Physica status solidi. A, Applications and materials science (24.10.2018)
Published in Physica status solidi. A, Applications and materials science (24.10.2018)
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Journal Article
Probe Array from BeCu Metal Sheet Using Heat and Fusing Currents
Kim, Sangwon, Cho, Chanseob, Kim, Bonghwan
Published in International journal of engineering & technology (Dubai) (04.07.2018)
Published in International journal of engineering & technology (Dubai) (04.07.2018)
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Journal Article
Surface texturing method for silicon solar cell using reactive ion etching with metal mesh: Surface texturing method for silicon solar cell
Cho, Chanseob, Kong, Daeyoung, Oh, Jung-Hwa, Kim, Bonghwan, Lee, Byeungleul, Lee, Jonghyun
Published in Physica status solidi. A, Applications and materials science (01.08.2014)
Published in Physica status solidi. A, Applications and materials science (01.08.2014)
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Journal Article
Fabrication of black silicon by using RIE texturing process as metal mesh
Daeyoung Kong, Junghwa Oh, Seongchan Jeon, Bonghwan Kim, Chanseob Cho, Jonghyun Lee
Published in 2012 17th Opto-Electronics and Communications Conference (01.07.2012)
Published in 2012 17th Opto-Electronics and Communications Conference (01.07.2012)
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Conference Proceeding
Cantilever arrayed blood pressure sensor for arterial applanation tonometry
Byeungleul Lee, Jinwoo Jeong, Chanseob Cho, Jinseok Kim, Bonghwan Kim, Hyeon Cheol Kim, Kukjin Chun
Published in The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.04.2013)
Published in The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.04.2013)
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Conference Proceeding
Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package
Kim, Sangwon, Lee, Junman, Nam, Jaewoo, Kim, Bonghwan, Cho, Chanseob, Kim, Jung Yup, Choi, Hongsoo
Published in Journal of mechanical science and technology (01.07.2014)
Published in Journal of mechanical science and technology (01.07.2014)
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Journal Article