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Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patternsElectronic supplementary information (ESI) available. See DOI: 10.1039/c7ra01005b
Huang, Kuan-Ming, Tsukamoto, Hiroki, Yong, Yingqiong, Chiu, Hsien-Lung, Nguyen, Mai Thanh, Yonezawa, Tetsu, Liao, Ying-Chih
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Year of Publication 10.05.2017
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Selective metallic coating of 3D-printed microstructures on flexible substratesElectronic supplementary information (ESI) available. See DOI: 10.1039/c7ra11171a
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Year of Publication 07.11.2017
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