The potential of using refractory metals and barrier layers to generate high temperature interconnects
Thomas, M.E., Hartnett, M.P., McKay, J.E., Kapoor, A.K., Chinn, J.D.
Published in 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference (1988)
Published in 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference (1988)
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Conference Proceeding
Advanced submicron research and technology development at the national submicron facility
Wolf, E.D., Isaacson, M.S., Krusius, J.P., Muray, A.J., Siegel, B.M., Sonek, G.J., Wicks, G.W., Wood, C.E.C., Adesida, I., Ballantyne, J.M., Buhrman, R.A., Chinn, J.D., Eastman, L.F., Everhart, T.E., Frey, J., Hanson, G.R.
Published in Proceedings of the IEEE (1983)
Published in Proceedings of the IEEE (1983)
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Journal Article