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Investigation of Solder Void Improvement on Automotive Parts
by
Brian, Aranas Guadalquever
,
Chinathamby
,
Pavendhran
,
Chaw, Wing Onn
,
Chang, Ting Wei
Published in
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
(19.10.2022)
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Conference Proceeding
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Conference Proceeding
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automotive parts
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behavioral sciences
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continuous improvement
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electronics industry
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high-voltage techniques
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low resistance
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