Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement
Zhu, W.H., Guang Li, Wei Sun, Che, F.X., Sun, A., Wang, C.K., Tan, H.B., Zhao, B.Z., Chin, N.H.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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