An analytical procedure for estimating field lifetime and failure rate of electronic packages
Hsu, Yao, Su, Chih-Yen, Wu, Wen-Fang
Published in Journal of the Chinese Institute of Engineers (01.01.2014)
Published in Journal of the Chinese Institute of Engineers (01.01.2014)
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Journal Article
Data-Centric Scheduling for Minimizing Queue Length in Wireless Machine-to-Machine Networks
Hsieh, Hung-Yun, Su, Chih-Yen
Published in 2019 IEEE Global Communications Conference (GLOBECOM) (01.12.2019)
Published in 2019 IEEE Global Communications Conference (GLOBECOM) (01.12.2019)
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Conference Proceeding
Effect of parametric randomness on reliability analysis of wafer-level chip-scale packages
Wen-Fang Wu, Teng-Kai Hsu, Chih-Yen Su, Yao-Chung Chen, Yao Hsu
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Vibration induced fatigue reliability of BGA packages
Yao Hsu, Wei-Kuo Kong, Chih-Yen Su, Wen-Fang Wu, Ming-Wei Liu
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding