Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
Choi, W.K., Premachandran, C.S., Chiew, O.S., Ling, X., Ebin, L., Khairyanto, A., Ratmin, B., Sheng, K.C.W., Thaw, P.P., Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Evolution of Microstructure and Mechanical Properties of Eutectic Sn-Pb Solder Joint Aged under Thermal Gradient
Kumar, A., Chiew, O.S., Wong, C.C., Zhong Chen, Yoon, S.W., Kripesh, V.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding