Demonstration and Electrical Performance of Cu-Cu Bonding at 150 °C With Pd Passivation
Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Chen, Kuan-Neng
Published in IEEE transactions on electron devices (01.08.2015)
Published in IEEE transactions on electron devices (01.08.2015)
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Journal Article
Identifying Risk Factors for Prolonged Length of Stay in Hospital and Developing Prediction Models for Patients with Cardiac Arrest Receiving Targeted Temperature Management
Chiu, Wei-Ting, Chan, Lung, Masud, Jakir Hossain Bhuiyan, Hong, Chien-Tai, Chien, Yu-San, Hsu, Chih-Hsin, Wu, Cheng-Hsueh, Wang, Chen-Hsu, Tan, Shennie, Chung, Chen-Chih
Published in Reviews in cardiovascular medicine (01.02.2023)
Published in Reviews in cardiovascular medicine (01.02.2023)
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Journal Article
Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration
Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chiou, Jin-Chern, Chuang, Ching-Te, Hwang, Wei, Tong, Ho-Ming, Chen, Kuan-Neng
Published in IEEE electron device letters (01.12.2013)
Published in IEEE electron device letters (01.12.2013)
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Journal Article
TIMECARD score: An easily operated prediction model of unfavorable neurological outcomes in out-of-hospital cardiac arrest patients with targeted temperature management
Lin, Jr-Jiun, Huang, Chien-Hua, Chien, Yu-San, Hsu, Chih-Hsin, Chiu, Wei-Ting, Wu, Cheng-Hsueh, Wang, Chen-Hsu, Tsai, Min-Shan
Published in Journal of the Formosan Medical Association (01.04.2023)
Published in Journal of the Formosan Medical Association (01.04.2023)
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Journal Article
Successful Rescue of a Ruptured Tracheoinnominate Fistula with Extracorporeal Membrane Oxygenation, Endovascular Stents, and Debranching Surgical Bypass
Chien, Yu-San, Chao, Yen-Chun, Lee, Kuo-Sheng, Hsu, Kung-Hong
Published in Annals of Thoracic and Cardiovascular Surgery (01.01.2020)
Published in Annals of Thoracic and Cardiovascular Surgery (01.01.2020)
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Journal Article
Predicting the survivals and favorable neurologic outcomes after targeted temperature management by artificial neural networks
Chiu, Wei-Ting, Chung, Chen-Chih, Huang, Chien-Hua, Chien, Yu-san, Hsu, Chih-Hsin, Wu, Cheng-Hsueh, Wang, Chen-Hsu, Chiu, Hung-Wen, Chan, Lung
Published in Journal of the Formosan Medical Association (01.02.2022)
Published in Journal of the Formosan Medical Association (01.02.2022)
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Journal Article
Post-cardiac arrest care and targeted temperature management: A consensus of scientific statement from the Taiwan Society of Emergency & Critical Care Medicine, Taiwan Society of Critical Care Medicine and Taiwan Society of Emergency Medicine
Chiu, Wei-ting, Lin, Kun-Chang, Tsai, Min-Shan, Hsu, Chih-Hsin, Wang, Chen-Hsu, Kuo, Li- Kuo, Chien, Yu-san, Wu, Cheng-Hsueh, Lai, Chih-Hung, Huang, Wei-Chun, Wang, Chih-Hsien, Wang, Tzong-Luen, Hsu, Hsin-Hui, Lin, Jen-Jyh, Hwang, Juey-Jen, Ng, Chip-Jin, Choi, Wai-Mau, Huang, Chien-Hua
Published in Journal of the Formosan Medical Association (01.01.2021)
Published in Journal of the Formosan Medical Association (01.01.2021)
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Journal Article
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
Chien, Yu-San, Huang, Yan-Pin, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chuang, Ching-Te, Hwang, Wei, Chiou, Jin-Chern, Tong, Ho-Ming, Chen, Kuan-Neng
Published in IEEE transactions on electron devices (01.04.2014)
Published in IEEE transactions on electron devices (01.04.2014)
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Journal Article
Clinical outcomes of handmade polytetrafluoroethylene trileaflet-valved conduit used for pulmonary valve replacement
Chang, Te-I, Hsu, Kang-Hong, Hung, Wei-Li, Yeh, Shu-Jen, Chen, Ming-Ren, Chien, Yu-San, Hsu, Ron-Bin, Wang, Jou-Kou, Chang, Ruey-Feng, Chang, Chung-I
Published in European journal of cardio-thoracic surgery (01.06.2023)
Published in European journal of cardio-thoracic surgery (01.06.2023)
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Journal Article
Effect of Standardized Bundle Care and Bundle Compliance on Reducing Surgical Site Infections: A Pragmatic Retrospective Cohort Study
Chien, Yu-San, Chen, Hsiang-Ting, Chiang, Hsiu-Tzy, Luo, Tz-Shin, Yeh, Hung-I, Sheu, Jin-Cherng, Li, Jiun-Yi
Published in Medical science monitor (25.03.2024)
Published in Medical science monitor (25.03.2024)
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Journal Article
Outcomes of Targeted Temperature Management for In-Hospital and Out-Of-Hospital Cardiac Arrest: A Matched Case-Control Study Using the National Database of Taiwan Network of Targeted Temperature Management for Cardiac Arrest (TIMECARD) Registry
Chien, Yu-San, Tsai, Min-Shan, Huang, Chien-Hua, Lai, Chih-Hung, Huang, Wei-Chun, Chan, Lung, Kuo, Li-Kuo
Published in Medical science monitor (10.07.2021)
Published in Medical science monitor (10.07.2021)
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Journal Article
The Differences of CPR duration between Shockable and Nonshockable Rhythms in Predicting the Benefit of Target Temperature Management
Lin, Jr-Jiun, Huang, Chien-Hua, Chien, Yu-San, Hsu, Chih-Hsin, Chiu, Wei-Ting, Wu, Cheng-Hsueh, Wang, Chen-Hsu, Tsai, Min-Shan
Published in Shock (Augusta, Ga.) (01.05.2022)
Published in Shock (Augusta, Ga.) (01.05.2022)
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Journal Article
Predictors and outcomes of respiratory failure among hospitalized pneumonia patients with 2009 H1N1 influenza in Taiwan
Chien, Yu-San, Su, Chia-Ping, Tsai, Huai-Te, Huang, Angela S, Lien, Chia-En, Hung, Min-Nan, Chuang, Jen-Hsiang, Kuo, Hsu-Sung, Chang, Shan-Chwen
Published in The Journal of infection (01.02.2010)
Published in The Journal of infection (01.02.2010)
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Journal Article
Investigation of low temperature Cu/In bonding in 3D integration
Yu-Sheng Hsieh, Ting-Ting Shen, Yu-San Chien, Kuan-Neng Chen, Shinozaki, Yuko, Kawasaki, Naohiko
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
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Conference Proceeding
Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration
Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications
Ruoh-Ning Tzeng, Yan-Pin Huang, Yu-San Chien, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Low temperature (<180 °C) bonding for 3D integration
Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding