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Year of Publication 29.08.2019
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Year of Publication 29.08.2019
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Year of Publication 23.03.2017
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Year of Publication 23.03.2017
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Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Year of Publication 29.02.2024
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Year of Publication 29.02.2024
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The Comparative Study of High and Low Temperature Cure Polyimide For Wafer Level Package With Ultra-Thick Re-distribution Copper Layer
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Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
WIRELESS TRANSMISSION MODULE
LIN, Chien-Hung, CHIEN, Feng-Lung, LAI, Ni-Ni, HSU, Hsiang-Hui, CHEN, Mao-Chun
Year of Publication 21.12.2023
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Year of Publication 21.12.2023
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WIRELESS TRANSMISSION MODULE
LIN, Chien-Hung, CHIEN, Feng-Lung, LAI, Ni-Ni, HSU, Hsiang-Hui, CHEN, Mao-Chun
Year of Publication 20.12.2023
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Year of Publication 20.12.2023
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WIRELESS TRANSMISSION MODULE
LIN, Chien-Hung, CHIEN, Feng-Lung, CHANG, Wen-Pin, LEE, Kuang-Lun, CHEN, Mao-Chun, CHANG, Chia Ho
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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