Taguchi DoE for ceramic substrate SMT defects improvement
Chun-Cheng Hsu, Ching-Shan Chien, Tzu-Yin Wei, Yun-Tsung Li, Hsun-Fa Li
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Taguchi DoE for Solder Voids Reduction
Chien, Ching-Shan, Chien, Chien-Wen, Li, Yun-Tsung, Li, Hsun-Fa
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding