Search Results - "Chiang, Yi-Che" :: K.UTB vyhledávací portál

Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

by Hao-Chih Chen, Yi-Che Chiang, Tuan-Yu Hung, Kuo-Ning Chiang
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)

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Design and experimental results of a wireless power receiver for the water pollution detection system

by Che-Yi Chiang, Long-Yi Lin, Hao-Chiao Hong
Published in 2015 International Symposium on Next-Generation Electronics (ISNE) (01.05.2015)

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Thermal analysis and reliability assessment of power module under power cycling test using global- local finite element method

by Yi-Che Chiang, Feng-Mao Hsu, Yen-Fu Su, Kuo-Ning Chiang
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)

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METHOD OF FABRICATING PACKAGE STRUCTURE

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 19.09.2024

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Patent

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Semiconductor device including a semiconductor die and a plurality of antenna patterns

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 25.06.2024

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PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHESIVE AND METHODS OF FORMING THE SAME

by Li, Chien-Chen, Liu, Kuo-Chio, Kuo, Chien-Li, Lin, Wen-Yi, Chiang, Yi-Che
Year of Publication 03.10.2024

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Semiconductor package and manufacturing method thereof

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 20.12.2022

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SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 10.11.2022

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INTEGRATED CIRCUIT PACKAGES AND METHODS

by Guo, Hong-Yu, Chiu, Yuan Sheng, Lin, Tsung-Shu, Chiang, Yi-Che, Pan, Hsin-Yu
Year of Publication 11.07.2024

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Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 13.09.2022

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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 12.08.2021

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SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 11.02.2021

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METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)

by Wu, Kai-Chiang, Yang, Ching-Feng, Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 08.09.2022

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Semiconductor device, package structure and method of fabricating the same

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 27.10.2020

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Semiconductor packages having thermal through vias (TTV)

by Wu, Kai-Chiang, Yang, Ching-Feng, Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 28.06.2022

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SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

by Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Year of Publication 06.08.2020

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PACKAGE STRUCTURE WITH ANTENNA ELEMENT

by SHIH, Chao-Wen, HSIAO, Min-Chien, CHIANG, Yi-Che, LIU, Chung-Shi, CHIANG, Yung-Ping, WU, Nien-Fang, YU, Chen-Hua, CHANG, Shou-Zen
Year of Publication 05.10.2023

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Chip package with antenna element

by Yu, Chen-Hua, Hsiao, Min-Chien, Shih, Chao-Wen, Chiang, Yung-Ping, Wu, Nien-Fang, Chang, Shou-Zen, Liu, Chung-Shi, Chiang, Yi-Che
Year of Publication 18.07.2023

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Patent