Signal Integrity analysis for high speed channels in pcb/package co-design interface: 3D full wave vs. 2d/hybrid approach & full model vs. segmentation approach
Scogna, Antonio Ciccomancini, Chun Tong Chiang, Krohne, Klaus, Lian Kheng Teoh, Hsuen-Yen Lee
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
De-embedding method and segmentation approach using full wave solver for high speed channels in PCB/package co-design
LianKheng Teoh, ChunTong Chiang, Scogna, Antonio Ciccomancini, Khrone, Klaus, HsuenYen Lee
Published in 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2014)
Published in 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2014)
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Conference Proceeding