Trust-Region Method with Deep Reinforcement Learning in Analog Design Space Exploration
Yang, Kai-En, Tsai, Chia-Yu, Shen, Hung-Hao, Chiang, Chen-Feng, Tsai, Feng-Ming, Wang, Chung-An, Ting, Yiju, Yeh, Chia-Shun, Lai, Chin-Tang
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
Published in 2021 58th ACM/IEEE Design Automation Conference (DAC) (05.12.2021)
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Conference Proceeding
Latchup test failure from ESD protection circuit activation beyond ESD stress condition
I-Cheng Lin, Che-Yuan Jao, Rei-Fu Huang, Cheng-Hsing Chien, Chien-Hui Chuang, Chen-Feng Chiang, Bo-Shih Huang
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Signal and Power Integrity Analysis of A 0.38 pJ/bit 12.8 Gb/s Parallel Interface for Die-to-Die Link Applications
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Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
A 7nm 0.46pJ/bit 20Gbps with BER 1E-25 Die-to-Die Link Using Minimum Intrinsic Auto Alignment and Noise-Immunity Encode
Hsu, Ying-Yu, Kuo, Po-Chun, Chuang, Chih-Lun, Chang, Po-Hao, Shen, Hung-Hao, Chiang, Chen-Feng
Published in 2021 Symposium on VLSI Circuits (13.06.2021)
Published in 2021 Symposium on VLSI Circuits (13.06.2021)
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Conference Proceeding
Trust-Region Method with Deep Reinforcement Learning in Analog Design Space Exploration
Yang, Kai-En, Chia-Yu, Tsai, Hung-Hao, Shen, Chen-Feng, Chiang, Feng-Ming, Tsai, Chung-An, Wang, Ting, Yiju, Yeh, Chia-Shun, Chin-Tang, Lai
Published in arXiv.org (02.12.2021)
Published in arXiv.org (02.12.2021)
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Paper
Journal Article
A 7nm 0.46pJ/bit 20Gbps with BER 1E-25 Die-to-Die Link Using Minimum Intrinsic Auto Alignment and Noise-Immunity Encode
Hsu, Ying-Yu, Kuo, Po-Chun, Chuang, Chih-Lun, Chang, Po-Hao, Shen, Hung-Hao, Chiang, Chen-Feng
Published in 2021 Symposium on VLSI Technology (13.06.2021)
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Published in 2021 Symposium on VLSI Technology (13.06.2021)
Conference Proceeding