Contact resistance of the micro bumps in a typical TSV structure
Ben-Je Lwo, Chia-Liang Teng, Ni, Tom, Lu, Shirley
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Thermal humidity reliability criterions for a typical TSV device
Ben-Je Lwo, Chia-Liang Teng, Zi-Yan Huang, Kuo-Hao Tseng, Kun-Fu Tseng
Published in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2016)
Published in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01.05.2016)
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Conference Proceeding