New DRAM HCI qualification method emphasizing on repeated memory access
Chia, Pierre Chor-Fung, Shi-Jie Wen, Baeg, Sang H
Published in 2010 IEEE International Integrated Reliability Workshop Final Report (01.10.2010)
Published in 2010 IEEE International Integrated Reliability Workshop Final Report (01.10.2010)
Get full text
Conference Proceeding
Reliability Challenges in 2.5D and 3D IC Integration
Li Li, Ton, Paul, Nagar, Mohan, Chia, Pierre
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Get full text
Conference Proceeding
AC-DC factor sensitivity for DRAM components lifetime under hot-carrier injection
Baeg, S, Nam, H, Chia, P, Wen, S, Wong, R
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Get full text
Conference Proceeding
3D SiP with Organic Interposer for ASIC and Memory Integration
Li Li, Chia, Pierre, Ton, Paul, Nagar, Mohan, Patil, Sada, Jie Xue, Delacruz, Javier, Voicu, Marius, Hellings, Jack, Isaacson, Bill, Coor, Mark, Havens, Ross
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Get full text
Conference Proceeding
Effect of high temperature storage on the stress and reliability of 3D stacked chip
Tengfei Jiang, Chenglin Wu, Peng Su, Chia, Pierre, Li Li, Ho-Young Son, Min-Suk Suh, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Get full text
Conference Proceeding
DRAM failure cases under hot-carrier injection
Sanghyeon Baeg, Chia, P., ShiJie Wen, Wong, R.
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)
Get full text
Conference Proceeding
Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction
Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Chia, Pierre, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding