Signal integrity study of high density through silicon via (TSV) technology
Bok Eng Cheah, Kong, Jackson, Chee Kit Chew, Kooi Chi Ooi, Periaman, Shanggar
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
IMPEDANCE MATCHING IN A TRANSMISSION LINE
LEDDIGE MICHAEL W, TAN WEI JERN, ABDUL KHALID NATASYA ATHIRAH, HECK HOWARD L, CHEW CHEE KIT
Year of Publication 16.06.2016
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Year of Publication 16.06.2016
Patent