Effect of Package Singulation Parameters on Dual Flat Non-leaded Package Delamination
Wu, Siying, Tan, Shwu Miin, Xue, Jianlu, Ng, Cheong Huat, Li, Zhigang
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
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Conference Proceeding
Capillary underfill and mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate
Chee Choong Kooi, Lim Szu Shing, Periaman, S., Chui, J., Then, E., Ng Cheong Huat, Low Mun Fai
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
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Conference Proceeding
Capillary underfill and mold encapsulation method and apparatus
Lai, Yin Men, Chee, Choong Kooi, Then, Edward, Ng, Cheong Huat, Low, Mun Fai
Year of Publication 28.08.2007
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Year of Publication 28.08.2007
Patent
Capillary underfill and mold encapsulation method and apparatus
LAI YIN MEN, NG CHEONG HUAT, THEN EDWARD, CHEE CHOONG KOOI, LOW MUN FAI
Year of Publication 28.08.2007
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Year of Publication 28.08.2007
Patent