A New Method for Lift-off of III-Nitride Semiconductors for Heterogeneous Integration
Zang, Ke Yan, Cheong, Davy W. C., Liu, Hong Fei, Liu, Hong, Teng, Jing Hua, Chua, Soo Jin
Published in Nanoscale research letters (01.06.2010)
Published in Nanoscale research letters (01.06.2010)
Get full text
Journal Article
A general relation for contact stiffness including adhesion in indentation analysis
Lu, Pin, Foo, Yong L., Shen, Lu, Cheong, Davy W.C., O’Shea, Sean J.
Published in Journal of materials research (14.06.2011)
Published in Journal of materials research (14.06.2011)
Get full text
Journal Article