Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm
Chengyi, Liao, Qi, Zheng, Fengman, Liu, Huimin, He, Qidong, Wang
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Carrier phase-based ionospheric gradient monitor for dynamic platform
Li, Jiaxiang, Liao, Chengyi, Zhu, Shengjie, Jiang, Xiaoying
Published in 2024 43rd Chinese Control Conference (CCC) (28.07.2024)
Published in 2024 43rd Chinese Control Conference (CCC) (28.07.2024)
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Conference Proceeding
Challenges and Technologies of Frontside Via-Last Active-Interposer Processes on Low-k Material for 3D Chiplet
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (22.08.2024)
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Journal Article
Enhanced Fabrication and Assembly of 3-D Chiplets Based on Active Interposer with Frontside Via-last TSVs
Liao, Chengyi, He, Huimin, Wang, Xugang, Cao, Rui, Chen, Lijun, Peng, Cheng, Liu, Fengman, Cao, Liqiang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (14.08.2024)
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Journal Article
AUV Adaptive PID Control Method Based on Deep Reinforcement Learning
Liu, Rui, Cui, Zhiyan, Lian, Yue, Li, Kai, Liao, Chengyi, Su, Xiaopeng
Published in 2023 China Automation Congress (CAC) (17.11.2023)
Published in 2023 China Automation Congress (CAC) (17.11.2023)
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Conference Proceeding
Supporting mechanism and windproof device of portal crane
HE GUOQING, WANG LIDONG, LIAO CHENGYI, WANG LE, WANG TANGGAO, WANG RUCHAO
Year of Publication 14.06.2024
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Year of Publication 14.06.2024
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