Characterization of Solid-State Reaction of Barium Carbonate and Titanium Dioxide by Spatially Resolved Electron Energy Loss Spectroscopy
Matsumoto, Hiroaki, Kakibayashi, Hiroshi, Taniguchi, Yoshihumi, Cheng, I-Kuan, Lee, Ting-Tai, Hu, Ching-Li, Lee, Chun-Te, Fujimoto, Masayuki
Published in Journal of the American Ceramic Society (01.08.2013)
Published in Journal of the American Ceramic Society (01.08.2013)
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Journal Article
Phase Evolution of Solid-State BaTiO3 Powder Prepared by Different Starting BaCO3
Lee, Ting-Tai, Huang, Chi-Yuen, Chang, Che-Yuan, Cheng, I-Kuan, Hu, Ching-Li, Su, Che-Yi, Lee, Chun-Te, Fujimoto, Masayuki
Published in International journal of applied ceramic technology (01.09.2013)
Published in International journal of applied ceramic technology (01.09.2013)
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Journal Article
Application of failure analysis on package copper pillar bump electromigration
Wei-chiao Wang, Kuan-I Cheng, Sung-Mao Wu
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Dielectric constant measure using near-field measurement system
Li-Xuan Tsai, Cheng, Sung-Mao Wu
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Electrical analysis and solder joint quality of PCB land-pad design for QFP E-pad package
Kuan-I Cheng, Yi-Cheng Liu, Pai-Chou Liu, Sung-Mao Wu
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Electromigration and failure analysis for copper pillar bump in QFN package
Yi-Shu Hsieh, Shang-Lin Wu, Kuan-I Cheng, Sung-Mao Wu, Tung-Bao Lu, Liang-Tian Lu
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Phase evolution of solid-state BaTiO sub(3) powder prepared with the ultrafine BaCO sub(3) and TiO sub(2)
Lee, Ting-Tai, Huang, Chi-Yuen, Chang, Che-Yuan, Cheng, I-Kuan, Hu, Ching-Li, Lee, Chun-Te, Fujimoto, Masayuki
Published in Journal of materials research (14.10.2012)
Published in Journal of materials research (14.10.2012)
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Journal Article
Phase Evolution of Solid‐State BaTiO 3 Powder Prepared by Different Starting BaCO 3
Lee, Ting‐Tai, Huang, Chi‐Yuen, Chang, Che‐Yuan, Cheng, I‐Kuan, Hu, Ching‐Li, Su, Che‐Yi, Lee, Chun‐Te, Fujimoto, Masayuki
Published in International journal of applied ceramic technology (01.09.2013)
Published in International journal of applied ceramic technology (01.09.2013)
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Journal Article
Methods for the reduction of the micropipe density in SiC single crystals
Liu, Jun Lin, Gao, Ji Qiang, Cheng, Ji Kuan, Yang, Jian Feng, Qiao, Guan Jun
Published in Journal of materials science (01.08.2007)
Published in Journal of materials science (01.08.2007)
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Journal Article
Reliability analysis experiment of electro migration and maximum current test
Chi-Yang Li, Kuan-I Cheng, Sung-Mao Wu, Tung-Bao Lu, Yi-Chang Lee
Published in 2015 Asia-Pacific Microwave Conference (APMC) (01.12.2015)
Published in 2015 Asia-Pacific Microwave Conference (APMC) (01.12.2015)
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Conference Proceeding
Dielectric ceramic material, method for producing the same and multi-layer ceramic capacitor
HSU, FONGI, LEE, CHUN-TE, YANG, KAI-HSUN, CHENG, I-KUAN, CHEN, CHUN-WEI
Year of Publication 01.03.2023
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Year of Publication 01.03.2023
Patent
Novel correctable testing interface for high speed/frequency device testing
Chih-Cheng Chuang, Kuan-l Cheng, Sung-Mao Wu, Lung-Shu Huang, Bang-Cheng Chiu
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
DIELECTRIC CERAMIC MATERIAL, METHOD FOR PRODUCING THE SAME AND MULTI-LAYER CERAMIC CAPACITOR
LEE, CHUN-TE, CHENG, I KUAN, YANG, KAI HSUN, HSU, FONGCHI, CHEN, CHUN-WEI
Year of Publication 21.02.2022
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Year of Publication 21.02.2022
Patent
Fabrication method of packaging substrate
Chiu Cheng-Wen, Cheng Kuan-I, Wang Wei-Ping, Lin Pang-Chun, Hsiao Chin-Chih
Year of Publication 27.09.2016
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Year of Publication 27.09.2016
Patent