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Year of Publication 21.09.2016
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Year of Publication 31.12.2020
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On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
JONES Keith D, CHENEY Robert F, WENG Li-Sheng, KARHADE Omkar G, JIANG Hongjin, STARKSTON Robert, DHALL Ashish, RAMALINGAM Suriyakala, STOVER Patrick N, RAORANE Digvijay A, DHANE Kedar
Year of Publication 15.09.2016
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Year of Publication 15.09.2016
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On package floating metal/stiffener grounding to mitigate rfi and si risks
CHENEY, ROBERT F, WENG, LI-SHENG, STOVER, PATRICK N, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, JIANG, HONGJIN, STARKSTON, ROBERT
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Year of Publication 11.05.2019
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Potentialfreie Metall/Versteifungs-Erdung am Gehäuse, um RFI- und SI-Risiken zu mildern
Dhall, Ashish, Starkston, Robert, Raorane, Digvijay A, Jones, Keith D, Dhane, Kedar, Weng, Li-Sheng, Jiang, Hongjin, Ramalingam, Suriyakala, Cheney, Robert F, Karhade, Omkar G, Stover, Patrick N
Year of Publication 15.09.2016
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Year of Publication 15.09.2016
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On package floating metal/stiffener grounding to mitigate RFI and SI risks
JIANG, HONG-JIN, CHENEY, ROBERT F, WENG, LI-SHENG, STOVER, PATRICK N, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, STARKSTON, ROBERT
Year of Publication 16.01.2017
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Year of Publication 16.01.2017
Patent
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
CHENEY, ROBERT F, STOVER, PATRICK N, WENG, LI-SHENG, JONES, KEITH D, RAMALINGAM, SURIYAKALA, RAORANE, DIGVIJAY A, DHALL, ASHISH, KARHADE, OMKAR G, DHANE, KEDAR, JIANG, HONGJIN, STARKSTON, ROBERT
Year of Publication 21.09.2016
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Year of Publication 21.09.2016
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