Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
Liu, Chien-Min, Lin, Han-Wen, Huang, Yi-Sa, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, King-Ning
Published in Scientific reports (12.05.2015)
Published in Scientific reports (12.05.2015)
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Demonstration and Electrical Performance of Cu-Cu Bonding at 150 °C With Pd Passivation
Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Chen, Kuan-Neng
Published in IEEE transactions on electron devices (01.08.2015)
Published in IEEE transactions on electron devices (01.08.2015)
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Journal Article
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
Liu, Chien-Min, Lin, Han-wen, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, K.N.
Published in Scripta materialia (01.05.2014)
Published in Scripta materialia (01.05.2014)
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Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
Sang Hwui Lee, Kuan-Neng Chen, Lu, James Jian-Qiang
Published in Journal of microelectromechanical systems (01.08.2011)
Published in Journal of microelectromechanical systems (01.08.2011)
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Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via
Tsai, Yi-Chieh, Lee, Chia-Hsuan, Chang, Hsin-Chi, Liu, Jui-Han, Hu, Han-Wen, Ito, Hiroyuki, Kim, Young Suk, Ohba, Takayuki, Chen, Kuan-Neng
Published in IEEE transactions on electron devices (01.07.2021)
Published in IEEE transactions on electron devices (01.07.2021)
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Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration
Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chiou, Jin-Chern, Chuang, Ching-Te, Hwang, Wei, Tong, Ho-Ming, Chen, Kuan-Neng
Published in IEEE electron device letters (01.12.2013)
Published in IEEE electron device letters (01.12.2013)
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Journal Article
Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application
Yao-Jen Chang, Yu-Sheng Hsieh, Kuan-Neng Chen
Published in IEEE electron device letters (01.11.2014)
Published in IEEE electron device letters (01.11.2014)
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Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
Huang, Yuan-Chiu, Hu, Han-Wen, Liu, Yun-Hsi, Hsieh, Hui-Ching, Chen, Kuan-Neng
Published in IEEE journal of the Electron Devices Society (2024)
Published in IEEE journal of the Electron Devices Society (2024)
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Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme
Chang, Yao-Jen, Ko, Cheng-Ta, Chen, Kuan-Neng
Published in IEEE electron device letters (01.01.2013)
Published in IEEE electron device letters (01.01.2013)
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Journal Article
An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem
Hu, Yu-Chen, Huang, Yu-Chieh, Huang, Po-Tsang, Wu, Shang-Lin, Chang, Hsiao-Chun, Yang, Yu-Tao, You, Yan-Huei, Chen, Jr-Ming, Huang, Yan-Yu, Lin, Yen-Han, Duann, Jeng-Ren, Chiu, Tzai-Wen, Hwang, Wei, Chuang, Ching-Te, Chiou, Jin-Chern, Chen, Kuan-Neng
Published in IEEE transactions on electron devices (01.04.2017)
Published in IEEE transactions on electron devices (01.04.2017)
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Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Hung, Tzu-Heng, Chen, Kuan-Neng
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
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