Board Level Reliability Study of Fan-Out Single Die Package with 350um Bump Pitch
Lai, Chieh-Lung, Lin, Gu-Yan, Chao, Tz-Yuan, Chen, Yih-Sin, Chien, Feng-Lung
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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