Broadband, quad flat no-lead (QFN) package developed using standard overmold leadframe technology
Chen, Morgan J, Tabatabaei, Seyed A
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
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Conference Proceeding
Design and Fabrication of Ultra-Wideband Baluns Embedded in Multilayer Liquid Crystal Polymer Flex
Chen, A.C., Chen, M.J., Anh-Vu Pham
Published in IEEE transactions on advanced packaging (01.08.2007)
Published in IEEE transactions on advanced packaging (01.08.2007)
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Journal Article
Broadband, Thin-Film, Liquid Crystal Polymer Air-Cavity Quad Flat No-Lead (QFN) Package
Chen, M.J., Tabatabaei, S.A.
Published in 2009 Annual IEEE Compound Semiconductor Integrated Circuit Symposium (01.10.2009)
Published in 2009 Annual IEEE Compound Semiconductor Integrated Circuit Symposium (01.10.2009)
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Conference Proceeding
Thin-film LCP amplitude compensated long time delay circuit
Chen, Morgan J., Zhaonian Zhang, Pham, Anh-Vu H., Hyman, Daniel J.
Published in 2008 IEEE MTT-S International Microwave Symposium Digest (01.06.2008)
Published in 2008 IEEE MTT-S International Microwave Symposium Digest (01.06.2008)
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Conference Proceeding
LCP for wafer-level chip-scale MEMS
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Fabrication techniques for processing LCP
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Introduction to electronic package engineering
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP reliability
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP for surface mount interconnects, packages, and modules
Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
Characteristics of liquid crystal polymer (LCP)
Chen, Morgan J., Aihara, Kunia, Chen, Cheng, Pham, Anh-Vu H.
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP for passive components
Ta, Hai, Chen, Morgan J., Aihara, Kunia, Chen, Andy C., Chieh, Jia-Chi Samuel, Pham, Anh-Vu H.
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter
LCP for system design
Chen, Morgan J., Aihara, Kunia, Chen, Andy C., Chieh, Jia-Chi Samuel, Pham, Anh-Vu H.
Published in LCP for Microwave Packages and Modules (21.06.2012)
Published in LCP for Microwave Packages and Modules (21.06.2012)
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Book Chapter