The influence of abrasive particle size in copper chemical mechanical planarization
WEI, Kuo-Hsiu, WANG, Yu-Sheng, LIU, Chuan-Pu, CHEN, Kei-Wei, WANG, Ying-Lang, CHENG, Yi-Lung
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Published in Surface & coatings technology (01.09.2013)
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Conference Proceeding
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Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing
Cheng, Min-Yuan, Chen, Kei-Wei, Liu, Tzeng-Feng, Wang, Ying-Lang, Feng, Hsien-Ping
Published in Thin solid films (01.10.2010)
Published in Thin solid films (01.10.2010)
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Conference Proceeding
Effects of (002) β-Ta barrier on copper chemical mechanical polishing behavior
Wang, Yu-Sheng, Chen, Kei-Wei, Cheng, Min-Yuan, Lee, Wen-Hsi, Wang, Ying-Lang
Published in Thin solid films (01.02.2013)
Published in Thin solid films (01.02.2013)
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Journal Article
Conference Proceeding
SYSTEM AND METHOD FOR REMOVING IMPURITIES DURING CHEMICAL MECHANICAL PLANARIZATION
CHEN CHIH HUNG, CHEN KEI WEI, CHEN YING TSUNG, NIEN PO CHIN, HOU TE CHIEN
Year of Publication 30.12.2022
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Year of Publication 30.12.2022
Patent
A Strategic Copper Plating Method Without Annealing Process
Chen, Kei-Wei, Hsu, Li-Hsuan, Huang, Jiun-Kai, Wang, Ying-Lang, Lo, Kuang-Yao
Published in Journal of the Electrochemical Society (2009)
Published in Journal of the Electrochemical Society (2009)
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Journal Article
Investigation of Bis-(3-sodiumsulfopropyl disulfide) (SPS) Decomposition in a Copper-Electroplating Bath Using Mass Spectroscopy
Hung, Chi-Cheng, Lee, Wen-Hsi, Hu, Shao-Yu, Chang, Shih-Chieh, Chen, Kei-Wei, Wang, Ying-Lang
Published in Journal of the Electrochemical Society (2008)
Published in Journal of the Electrochemical Society (2008)
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Journal Article