by Meng-Kai Shih, Hsu, Charles, Yungshun Chang, Karenyu Chen, Ian Hu, Teck Lee, Tarng, David, Hung, C. P.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

by Mengkai Shih, Hsu, Charles, Yungshun Chang, KarenYu Chen, Kao, Golden
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)

by Lai, Wei-Hong, Yang, Penny, Hu, Ian, Liao, Tse-Wei, Chen, KarenYU, Tarng, David, Hung, CP
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by Wang, Ming-Han, Chen, Karen YU, Lin, Guan-Han, Cheng, Frank, Shih, Meng-Kai, Yen, Shiu-Fang
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)

by Shih, Meng-Kai, Tsai, Eddie, Tarng, David, Hung, C.P., Chen, Ryan, Chen, Peter B.S., Lee, Ying-Chih, Chen, Karen Y.U., Hu, Ian, Chen, Tang-Yuan, Tsai, Lung, Chen, Eatice
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

by Ian Hu, Ming-Han Wang, Yu Chen, Karen, Ying-Chih Lee, Mengkai Shih
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)