METHOD FOR FORMING A METAL CONTACT
DIXIT, GIRISH A, LIN, YIH-SHUNG, CHEN, FUSEN E, LIOU, FU-TAI, WEI, CHEIA
Year of Publication 01.05.2000
Get full text
Year of Publication 01.05.2000
Patent
Method for depositing a diffusion barrier layer and a metal conductive layer
Yao, Gongda, Chen, Fusen E, Chiang, Tony, Kohara, Gene Y, Ding, Peijun, Xu, Zheng, Chin, Barry L, Zhang, Hong
Year of Publication 05.06.2018
Get full text
Year of Publication 05.06.2018
Patent
METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCTIVE LAYER
CHEN Fusen E, YAO Gongda, CHIANG Tony, CHIN Barry L, KOHARA Gene Y, XU Zheng, DING Peijun, ZHANG Hong
Year of Publication 03.11.2016
Get full text
Year of Publication 03.11.2016
Patent
Method for depositing a diffusion barrier layer and a metal conductive layer
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 12.07.2016
Get full text
Year of Publication 12.07.2016
Patent
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 17.04.2012
Get full text
Year of Publication 17.04.2012
Patent
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 02.08.2011
Get full text
Year of Publication 02.08.2011
Patent
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 14.09.2010
Get full text
Year of Publication 14.09.2010
Patent
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 02.08.2011
Get full text
Year of Publication 02.08.2011
Patent
Method of depositing a sculptured copper seed layer
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 15.09.2009
Get full text
Year of Publication 15.09.2009
Patent
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 07.10.2010
Get full text
Year of Publication 07.10.2010
Patent
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 14.09.2010
Get full text
Year of Publication 14.09.2010
Patent
Method of depositing a metal seed layer on semiconductor substrates
Chiang, Tony, Yao, Gongda, Ding, Peijun, Chen, Fusen E, Chin, Barry L, Kohara, Gene Y, Xu, Zheng, Zhang, Hong
Year of Publication 03.06.2008
Get full text
Year of Publication 03.06.2008
Patent
Method for forming a metal contact
DIXIT, GIRISH A, LIN, YIH-SHUNG, CHEN, FUSEN E, LIOU, FU-TAI, WEI, CHEIA
Year of Publication 04.10.2006
Get full text
Year of Publication 04.10.2006
Patent
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 29.10.2009
Get full text
Year of Publication 29.10.2009
Patent
Method of depositing a sculptured copper seed layer
CHIN BARRY L, ZHANG HONG, YAO GONGDA, CHIANG TONY, CHEN FUSEN E, XU ZHENG, DING PEIJUN, KOHARA GENE Y
Year of Publication 15.09.2009
Get full text
Year of Publication 15.09.2009
Patent