Improving surface quality of polyethylene terephthalate film for large area flexible electronic applications
Wiria, Florencia Edith, Tham, Chu Long, Subramanian, Alamelu Suriya, Tey, Ju Nie, Qi, Xiaoying, Cheng, Chek Kweng, Salam, Budiman
Published in Journal of solid state electrochemistry (01.07.2016)
Published in Journal of solid state electrochemistry (01.07.2016)
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Journal Article
Ultrasonic welding aluminium alloy 7075 to titanium alloy Ti-6Al-4V: parameter optimization and mechanical property
Shibo, Liu, Guijun, Bi, Yijun, Man, Xianchong, Sun, Yang, Lee Bing, Dayou, Pan, Kweng, Cheng Chek
Published in IOP conference series. Materials Science and Engineering (01.01.2020)
Published in IOP conference series. Materials Science and Engineering (01.01.2020)
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Journal Article
Impact of Packaging Design on Reliability of Large Die Cu/Low- \kappa (BD) Interconnect
Chai, T. C., Zhang, X., Li, H. Y., Sekhar, V. N., Khan, O. K. N., Lau, J., Murthy, R., Yeow Meng Tan, Cheng, C. K., Siao Li Liew, Dongzhi Chi
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)
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Journal Article
Laser welding of CP Ti to stainless steel with different temporal pulse shapes
Chen, Hui-Chi, Bi, Guijun, Lee, Bing Yang, Cheng, Chek Kweng
Published in Journal of materials processing technology (01.05.2016)
Published in Journal of materials processing technology (01.05.2016)
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Journal Article
Biaxially stretchable transparent conductors that use nanowire networks
Ho, Xinning, Cheng, Chek Kweng, Tey, Ju Nie, Wei, Jun
Published in Journal of materials research (28.12.2014)
Published in Journal of materials research (28.12.2014)
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Journal Article
Highly flexible transparent conductors based on 2D silver nanowire network
Xinning Ho, Ju Nie Tey, Chek Kweng Cheng, Jun Wei
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Screen printing of stretchable electrodes for large area LED matrix
Ho, Xinning, Cheng, Chek Kweng, Tan, Rachel Lee Siew, Wei, Jun
Published in Journal of materials research (14.08.2015)
Published in Journal of materials research (14.08.2015)
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Journal Article
Impact of Packaging Design on Reliability of Large Die Cu/Low-[Formula Omitted] (BD) Interconnect
Chai, Tai Chong, Zhang, Xiaowu, Li, Hong Yu, Sekhar, Vasarla Nagendra, Khan, Oratti Kalandar Navas, Lau, John, Murthy, Ramana, Tan, Yeow Meng, Cheng, Chek Kweng, Liew, Siao Li, Chi, Dongzhi
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)
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Journal Article
Reliability assessment of high density fine pitch lead-free flip chip package
Ser Choong Chong, Simon Ting, Tan Yeow Meng, Chai Tai Chong, Srinivasamurthy Sampath, Hnin Wai Yin, Lim, S., Cheng Chek Kweng
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
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Conference Proceeding