A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages
Amin, Nowshad, Lim, Victor, Seng, Foong Chee, Razid, Rozaidi, Ahmad, Ibrahim
Published in Microelectronics and reliability (01.05.2009)
Published in Microelectronics and reliability (01.05.2009)
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Journal Article
Chip to chip interconnection for system in packaging using Cu stud bump
Muniandy, Kesvakumar, Khan, Navas, Foong Chee Seng, Lo, Calvin, Lim Meng Rong
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity
Teng Seng Kiong, Ruzaini, Ibrahim, Kesvakumar, Foong Chee Seng
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Wire diameter and length effects on wire sweep performance of multi-tier copper and gold wire bonding in plastic ball grid array packages
Hian, Serene Teh Seoh, Foong Chee Seng, Teng Seng Kiong, Kalandar, N. K. O.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Experimental methods in monitoring voids formation during flip chip underfill cure process
Foong Chee Seng, Tee Swee Xian, Wong Tzu Ling
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package
Lim, Victor, Ahmad, Ibrahim, Foong Chee Seng, Amin, Nowshad, Rasid, Rozaidi
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Packaged semiconductor device assembly
Singh, Akhilesh Kumar, Mahatme, Nihaar N, Lakhera, Nishant, Foong, Chee Seng, Mawer, Andrew Jefferson
Year of Publication 20.02.2024
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Year of Publication 20.02.2024
Patent
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
Swartjes, Franciscus Henrikus Martinus, Singh, Akhilesh Kumar, Foong, Chee Seng, Mawer, Andrew Jefferson
Year of Publication 27.12.2023
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Year of Publication 27.12.2023
Patent
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
Swartjes, Franciscus Henrikus Martinus, Singh, Akhilesh Kumar, Foong, Chee Seng, Mawer, Andrew Jefferson
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
Swartjes, Franciscus Henrikus Martinus, Singh, Akhilesh Kumar, Foong, Chee Seng, Mawer, Andrew Jefferson
Year of Publication 03.05.2023
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Year of Publication 03.05.2023
Patent