Study of Dynamic Warpage of Flip Chip Packages under Temperature Reflow
Chee Kan Lee, Wei Keat Loh, Kang Eu Ong, Chin, I.
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Investigation of solder bridging failure for molded matrix array package
Chong Kim Foong, Wong Shaw Fong, Leong Jenn Seong, He Yi, Lee Chee Kan, Kim Kay
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Impact of molding parameters on PBGA warpage characteristic
Loh Wei Keat, Quah Chin Aik, Lee Chee Kan, Lee Chek Loon
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
The next generation of quick turn method for interfacial strength testing: High Speed Ball Shear
Chee Kan Lee, Derek, Rebsom, Wei Keat Loh, Hui Ping Ng, Kam Wah Lau
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding