Crosstalk study of high speed on-package interconnects for multi-chip package
Bok Eng Cheah, Kong, Jackson, Khang Choong Yong, Lo, Louis, Po Yin Yaw
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTS FOR INTEGRATED-CIRCUIT PACKAGES
OOI PING PING, ONG JENNY SHIO YIN, LIM SEOK LING, CHEAH BOK ENG, KONG JACKSON CHUNG PENG
Year of Publication 22.06.2021
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Year of Publication 22.06.2021
Patent
COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTION FOR INTEGRATED CIRCUIT PACKAGE
OOI PING PING, LIM SEOK LING, CHEAH BOK ENG, JENNY SHIO YIN ONG, JACKSON CHUNG PENG KONG
Year of Publication 17.06.2021
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Year of Publication 17.06.2021
Patent
MICRO-HINGE FOR AN ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent
MICRO-HINGE FOR ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, JACKSON CHUNG PENG KONG
Year of Publication 25.04.2019
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Year of Publication 25.04.2019
Patent
Study of conductor surface roughness impact on package insertion loss
Lo, H. Louis, Bok Eng Cheah
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
FLEXIBLE PACKAGING ARCHITECTURE
CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 24.01.2018
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Year of Publication 24.01.2018
Patent
MICRO-HINGE FOR AN ELECTRONIC DEVICE
CHEAH BOK ENG, LOO HOWE YIN, LIM MIN SUET, OH POH TAT, KONG JACKSON CHUNG PENG
Year of Publication 05.10.2016
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Year of Publication 05.10.2016
Patent
3D Interconnects - The enabler of next generation multi-Gbps single-ended bus
Khang Choong Yong, Bok Eng Cheah, Kong, Jackson
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
A novel trench routing for next-generation high-speed serial buses beyond 10Gbps applications
Kong, Jackson, Bok Eng Cheah, Khang Choong Yong, Heck, Howard, Lo, Louis
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES
ZHAO JUNFENG, SHE YONG, SKINNER MICHAEL P, CHEAH BOK ENG, PERIAMAN SHANGGAR, TANG JIAMIAO, CHEW YEN HSIANG, SIR JIUN HANN, OOI KOOI CHI
Year of Publication 16.06.2016
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Year of Publication 16.06.2016
Patent
FLEXIBLE PACKAGING ARCHITECTURE
CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 02.05.2016
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Year of Publication 02.05.2016
Patent
Method to improve ball grid array Imax distribution for small form factor package design
Chin Lee Kuan, Huang, Jimmy, Bok Eng Cheah, Kong, Jackson
Published in 2015 6th Asia Symposium on Quality Electronic Design (ASQED) (01.08.2015)
Published in 2015 6th Asia Symposium on Quality Electronic Design (ASQED) (01.08.2015)
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Conference Proceeding
Study of dielectric material property impact on insertion loss for advanced packaging solutions
Bok Eng Cheah, Lo, H. Louis, Kong, Jackson
Published in 2015 IEEE International Conference on Consumer Electronics - Taiwan (01.06.2015)
Published in 2015 IEEE International Conference on Consumer Electronics - Taiwan (01.06.2015)
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Conference Proceeding
Segmented plated-thru-hole design in flip-chip packaging for improved electrical performance
Kong, Jackson, Bok Eng Cheah, Chin Lee Kuan, Ping Ping Ooi
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding