Germanium N and P Multifin Field-Effect Transistors With High-Performance Germanium (Ge) p+/n and n+/p Heterojunctions Formed on Si Substrate
CHEN, Che-Wei, CHUNG, Cheng-Ting, TZENG, Ju-Yuan, LI, Pin-Hui, CHANG, Pang-Sheng, CHIEN, Chao-Hsin, LUO, Guang-Li
Published in IEEE transactions on electron devices (01.04.2013)
Published in IEEE transactions on electron devices (01.04.2013)
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Journal Article
Epitaxial Germanium on SOI Substrate and Its Application of Fabricating High ION/IOFF Ratio Ge FinFETs
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Published in IEEE transactions on electron devices (2013)
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Published in IEEE transactions on electron devices (2013)
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MAPLE: Enhancing Review Generation with Multi-Aspect Prompt LEarning in Explainable Recommendation
Yang, Ching-Wen, Chen, Che Wei, Wu, Kun-da, Xu, Hao, Yao, Jui-Feng, Kao, Hung-Yu
Year of Publication 19.08.2024
Year of Publication 19.08.2024
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Journal Article
Insulin-like growth factor receptor-1 overexpression is associated with poor response of rectal cancers to radiotherapy
Wu, Xiao-Yu, Wu, Zhen-Feng, Cao, Qin-Hong, Chen, Che, Chen, Zhi-Wei, Xu, Zhe, Li, Wei-Su, Liu, Fu-Kun, Yao, Xue-Quan, Li, Gang
Published in World journal of gastroenterology : WJG (21.11.2014)
Published in World journal of gastroenterology : WJG (21.11.2014)
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Journal Article
An Overview of Experiments and Numerical Simulations on Airflow and Aerosols Deposition in Human Airways and the Role of Bioaerosol Motion in COVID-19 Transmission
Mutuku, Justus Kavita, Hou, Wen-Che, Chen, Wei-Hsin
Published in Aerosol and Air Quality Research (01.06.2020)
Published in Aerosol and Air Quality Research (01.06.2020)
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SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
CHEN, CHE-WEI, YAUNG, DUN-NIAN, KAO, MIN-FENG, LIN, HSINGIH, LIU, JENNG
Year of Publication 22.12.2022
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Year of Publication 22.12.2022
Patent
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 16.11.2023
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Year of Publication 16.11.2023
Patent
Backside contact to improve thermal dissipation away from semiconductor devices
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 12.09.2023
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Year of Publication 12.09.2023
Patent
Experience with Conservative Strategy of Uterine Artery Embolization in the Treatment of Placenta Percreta in the First Trimester of Pregnancy
Shih-Hui Tseng, Chia-Hui Lin, Jen I. Hwang, Wei-Che Chen, Esther Shih-Chu Ho, Min-Min Chou
Published in Taiwanese Journal of Obstetrics & Gynecology (01.06.2006)
Published in Taiwanese Journal of Obstetrics & Gynecology (01.06.2006)
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三相分离法提取裂殖壶藻中油脂、蛋白质 和多糖的工艺优化Process optimization of three phase partitioning to extract the lipids, protein and polysaccharide from Schizochytrium sp
魏登枭1,车丹丹1,陈必链1,2,何勇锦1,2,3,周志华1 WEI Dengxiao1, CHE Dandan1, CHEN Bilian1,2, HE Yongjin1,2,3, ZHOU Zhihua1
Published in Zhongguo you zhi (01.03.2023)
Published in Zhongguo you zhi (01.03.2023)
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Journal Article
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 07.07.2022
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Year of Publication 07.07.2022
Patent
Backside contact to improve thermal dissipation away from semiconductor devices
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 29.03.2022
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Year of Publication 29.03.2022
Patent
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent
High performance Ge Schottky PMOSFETs with ternary-phase alloy
Chung-Chun Hsu, Wei-Chun Chi, Chen-Han Chou, Che-Wei Chen, Hung-Pin Chien, Chao-Hsin Chien
Published in 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2016)
Published in 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2016)
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