Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme
Che, Mu-Lung, Huang, Cheng-Ying, Choang, Shindy, Chen, Yu-Hen, Leu, Jihperng
Published in Journal of materials research (01.06.2010)
Published in Journal of materials research (01.06.2010)
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Journal Article
Effects of High-Temperature Porogens on Materials Properties of Novel 2-Pahse Low-k Dielectrics
Che, Mu-Lung, Leu, Jihperng, Chen, Yu-Hen, Huang, Cheng-Ying, Choang, Shindy
Published in ECS transactions (27.04.2007)
Published in ECS transactions (27.04.2007)
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Journal Article