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"Chaw Wing Onn"
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"Chaw Wing Onn"
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Thermal Stability Characterization of High-Temperature Solders in Power Surface Mount Devices
by
Le, Fred Fuliang
,
Guan, Zunyu
,
Chen, Haibin
,
Chaw
,
Wing Onn
,
Santican, Haima
Published in
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
(07.12.2022)
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Investigation of Solder Void Improvement on Automotive Parts
by
Brian, Aranas Guadalquever
,
Chinathamby, Pavendhran
,
Chaw
,
Wing Onn
,
Chang, Ting Wei
Published in
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
(19.10.2022)
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CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
by
Ting, Jia Yunn
,
Wing Onn
,
Chaw
,
Chang, Ting Wei
Year of Publication
07.02.2024
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CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
by
Chaw
,
Wing Onn
,
Ting, Jia Yunn
,
Chang, Ting Wei
Year of Publication
01.02.2024
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SEMICONDUCTOR DEVICE WITH WETTABLE CORNER LEADS
by
Keung Ho, Wai
,
Walcyzk, Sven
,
Lam, Kan Wae
,
Xue, Ke
,
Onn Chaw
,
Wing
Year of Publication
26.06.2019
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SEMICONDUCTOR DEVICE WITH WETTABLE CORNER LEADS
by
Keung Ho, Wai
,
Walcyzk, Sven
,
Lam, Kan Wae
,
Xue, Ke
,
Onn Chaw
,
Wing
Year of Publication
09.05.2018
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Semiconductor device with wettable corner leads
by
Lam Kan Wae
,
Ho Wai Keung
,
Walczyk Sven
,
Ke Xue
,
Chaw Wing Onn
Year of Publication
19.12.2017
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Semiconductor device with wettable corner leads and semiconductor device assembling method
by
WAI KEUNG HO
,
KAN WAE LAM
,
WING ONN CHAW
,
SVEN WALCZYK
,
XUE KE
Year of Publication
25.05.2018
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