Minimization of undercutting in electrochemical micromachining of patterned aluminum–copper films
Cosse, J T, López, G P, Atanassov, P, Bauer, T M, Chaudhury, Z A, Schwappach, C D, Mosley, L E, Brevnov, D A
Published in Journal of micromechanics and microengineering (01.01.2007)
Published in Journal of micromechanics and microengineering (01.01.2007)
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Experimental and analytical evaluation of damage processes in thermal barrier coatings
Nusier, S.Q., Newaz, G.M., Chaudhury, Z.A.
Published in International journal of solids and structures (01.05.2000)
Published in International journal of solids and structures (01.05.2000)
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Chronological evaluation of interfacial damage in TBC due to thermal cycling
CHAUDHURY, Z. A, NEWAZ, G. M, NUSIER, S. Q, AHMED, T, THOMAS, R. L
Published in Journal of materials science (15.05.1999)
Published in Journal of materials science (15.05.1999)
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Evaluation of bond integrity of TiO2-Y2O3 sensor using thermal wave imaging technique
CHAUDHURY, Z. A, AHMED, T, NEWAZ, G. M, WANG, L, AKBAR, S. A
Published in Materials letters (01.02.1998)
Published in Materials letters (01.02.1998)
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Journal Article
Width of Anodization Mask Required to Preserve a Metallic Phase during Porous-Type Anodization of Aluminum-Copper Films
Brevnov, Dmitri A, Womack, Robin L, Atanassov, Plamen, Lopez, Gabriel P, Bauer, Todd M, Chaudhury, Zariff A, Schwappach, Chris D, Mosley, Larry E
Published in Journal of the Electrochemical Society (01.01.2006)
Published in Journal of the Electrochemical Society (01.01.2006)
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