A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Chang, Yuan-Wei, Hu, Chia-chia, Peng, Hsin-Ying, Liang, Yu-Chun, Chen, Chih, Chang, Tao-chih, Zhan, Chau-Jie, Juang, Jing-Ye
Published in Scientific reports (12.04.2018)
Published in Scientific reports (12.04.2018)
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Through-Silicon Hole Interposers for 3-D IC Integration
Lau, John H., Lee, Ching-Kuan, Zhan, Chau-Jie, Wu, Sheng-Tsai, Chao, Yu-Lin, Dai, Ming-Ji, Tain, Ra-Min, Chien, Heng-Chieh, Hung, Jui-Feng, Chien, Chun-Hsien, Cheng, Ren-Shing, Huang, Yu-Wei, Cheng, Yu-Mei, Liao, Li-Ling, Lo, Wei-Chung, Kao, Ming-Jer
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
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Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
LEE, Chang-Chun, YANG, Tsung-Fu, KAO, Kuo-Shu, CHENG, Ren-Chin, ZHAN, Chau-Jie, CHEN, Tai-Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
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Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test
CHANG, Hung-Jen, CHANG, Tao-Chih, ZHAN, Chau-Jie, CHOU, Jung-Hua
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
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Influence of underfill materials on the reliability of coreless flip chip package
Chuang, Chun-Chih, Yang, Tsung-Fu, Juang, Jin-Ye, Hung, Yin-Po, Zhan, Chau-Jie, Lin, Yu-Min, Lin, Ching-Tsung, Chang, Pei-Chen, Chang, Tao-Chih
Published in Microelectronics and reliability (01.11.2008)
Published in Microelectronics and reliability (01.11.2008)
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Journal Article
Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film
Chang-Chun Lee, Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Chau-Jie Zhan, Tai-Hong Chen
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Reliability enhancements of chip-on-chip package with layout designs of microbumps
Lee, Chang-Chun, Kao, Kuo-Shu, Cheng, Ren-Shin, Zhan, Chau-Jie, Chang, Tao-Chih
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Conference Proceeding
Assembly technology development and failure analysis for three-dimensional integrated circuit integration with ultra-thin chip stacking
Lee, Chang-Chun, Lin, Yu-Min, Hsieh, Chia-Ping, Liou, Yan-Yu, Zhan, Chau-Jie, Chang, Tao-Chih, Wang, Chien-Ping
Published in Microelectronic engineering (20.04.2016)
Published in Microelectronic engineering (20.04.2016)
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Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material
Lee, Chang-Chun, Lin, Yu-Min, Guo, Yu-Huan, Zhan, Chau-Jie, Chang, Tao-Chih, Dzeng, Yu-Hua
Published in Vacuum (01.08.2015)
Published in Vacuum (01.08.2015)
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Journal Article
Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking
Yu-Min Lin, Chau-Jie Zhan, Jing-Ye Juang, Lau, J. H., Tai-Hong Chen, Lo, Robert, Kao, M., Tian Tian, King-Ning Tu
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Reliability evaluation of glass interposer module
Ching-Kuan Lee, Jen-Chun Wang, Chau-Jie Zhan, Wen-Wei Shen, Huan-Chun Fu, Yuan-Chang Lee, Chia-Wen Fan, Chen, K. C., Hsiang-Hung Chang, Lu, Yung Jean Rachel
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Electromigration in microbumps with Cu-Sn intermetallic compounds
Yi-Cheng Chu, Chau-Jie Zhan, Han-Wen Lin, Yu-Wei Huang, Chih Chen
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Printing functional substrate for flexible electronics
Wei-Han Hsiao, Chun-Wei Su, Hsin-Chung Wu, Yi-Chi Yang, Cheng-Yi Shih, Chau-Jie Zhan
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection
Chau-Jie Zhan, Chun-Chih Chuang, Jing-Ye Juang, Su-Tsai Lu, Tao-Chih Chang
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Bump resistance change behavior due to Cu-Sn IMCs formation with various solder diameters
Wan-Lin Hsieh, Chung-Kuang Lin, Chau-Jie Zhan, Yu-wei Huang, Chih Chen
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
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Conference Proceeding
Fabrication, assembly, failure estimations of for ultra-thin chips stacking by using pre-molding technology
Chang-Chun Lee, Yu-Min Lin, Yan-Yu Liou, Chau-Jie Zhan, Tao-Chih Chang
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding
Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material
Ren-Shin Cheng, Chau-Jie Zhan, Su-Yu Fun, Su-Ching Chung, Kuo-Chyuan Chen, Yu-Lan Lu, Chia-Wen Fan, Tao-Chih Chang
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design
Yu-Jen Chang, Hao-Hsiang Chuang, Yi-Chang Lu, Yih-Peng Chiou, Tzong-Lin Wu, Peng-Shu Chen, Shih-Hsien Wu, Tzu-Ying Kuo, Chau-Jie Zhan, Wei-Chung Lo
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding