Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability
Chaillot, A, Munier, C, Maire, O, Vigier, M, Chastanet, C
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Optimization of high density interconnections (HDI) printed circuit boards robustness
Chaillot, A., Maire, O., Munier, C., Tonnelier, L., Chastanet, C.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Fatigue life prediction models developed for Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)
Chaillot, A., Grieu, M., Munier, C., Lombaert-Valot, I., Bousquet, S., Chastanet, C., Canaud, J.-P., Dumonteil, R., Villard, S., Raynal, P., Maron, D.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)
Chaillot, A., Massiot, G., Munier, C., Lombaert-Valot, I., Bousquet, S., Chastanet, C., Plouseau, D., Munier, E., Maron, D., Raynal, P., Villard, S., Dumonteil, R.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding