Multimode Optical Interconnects on Silicon Interposer Enable Confidential Hardware-to-Hardware Communication
Zhang, Qian, Charania, Sujay, Rothe, Stefan, Koukourakis, Nektarios, Neumann, Niels, Plettemeier, Dirk, Czarske, Juergen W
Published in Sensors (Basel, Switzerland) (01.07.2023)
Published in Sensors (Basel, Switzerland) (01.07.2023)
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Journal Article
Design, Fabrication, and Comparison of 3D Multimode Optical Interconnects on Silicon Interposer
Charania, Sujay, Neumann, Niels, Killge, Sebastian, Winkler, Felix, Al-Husseini, Zaid, Szilagyi, Laszlo, Henker, Ronny, Ellinger, Frank, Plettemeier, Dirk, Bartha, Johann W.
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Published in Journal of lightwave technology (01.07.2020)
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Journal Article
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Year of Publication 11.05.2023
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Year of Publication 11.05.2023
Patent
3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration
Lungen, Sebastian, Tiedje, Tobias, Nieweglowski, Krzysztof, Lorenz, Lukas, Bock, Karlheinz, Charania, Sujay, Killge, Sebastian, Bartha, Johann
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Multi-Chip-Modul und Verfahren
Koukourakis, Nektarios, Charania, Sujay Ashok, Plettemeier, Dirk, Neumann, Niels, Rothe, Stefan, Czarske, Jürgen
Year of Publication 24.08.2023
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Year of Publication 24.08.2023
Patent
Multi-Chip-Modul und Verfahren
Koukourakis, Nektarios, Charania, Sujay Ashok, Plettemeier, Dirk, Neumann, Niels, Rothe, Stefan, Czarske, Jürgen
Year of Publication 11.05.2023
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Year of Publication 11.05.2023
Patent