Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Frank, T., Moreau, S., Chappaz, C., Leduc, P., Arnaud, L., Thuaire, A., Chery, E., Lorut, F., Anghel, L., Poupon, G.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
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Journal Article
An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization
Di Cioccio, L., Gueguen, P., Taibi, R., Landru, D., Gaudin, G., Chappaz, C., Rieutord, F., de Crecy, F., Radu, I., Chapelon, L. L., Clavelier, L.
Published in Journal of the Electrochemical Society (01.01.2011)
Published in Journal of the Electrochemical Society (01.01.2011)
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Journal Article
Resistance increase due to electromigration induced depletion under TSV
Frank, T, Chappaz, C, Leduc, P, Arnaud, L, Lorut, F, Moreau, S, Thuaire, A, El Farhane, R, Anghel, L
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
Lifetime extrapolation for Electromigration tests at wafer level with a dedicated device
Chappaz, C, Nakkala, P
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
Published in 2010 IEEE International Reliability Physics Symposium (01.05.2010)
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Conference Proceeding
Stress management strategy to limit die curvature during silicon interposer integration
Vianne, B., Farcy, A., Fiori, V., Chappaz, C., Chevrier, N., Lobascio, G., Chausse, P., Ponthenier, F., Ruckly, A., Escoubas, S., Thomas, O.
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
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Conference Proceeding
Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications
Casset, F., Danel, Js, Chappaz, C., Bernard, F., Basrour, S., Desloges, B., Fanget, S.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
4-inch transparent plates based on thin-film AlN actuators for haptic applications
Casset, F., Danel, JS, Renaux, P., Chappaz, C., Bernard, F., Sednaoui, T., Basrour, S., Desloges, B., Fanget, S.
Published in Mechatronics (Oxford) (01.12.2016)
Published in Mechatronics (Oxford) (01.12.2016)
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Journal Article
Design, Fabrication and Characterization of a Tactile Display Based on AlN Transducers
Bernard, F., Gorisse, M., Casset, F., Chappaz, C., Basrour, S.
Published in Procedia engineering (2014)
Published in Procedia engineering (2014)
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Journal Article
Characterization and post simulation of thin-film PZT actuated plates for haptic applications
Casset, F., Danel, Js, Renaux, P., Chappaz, C., Le Rhun, G., Dieppedale, C., Gorisse, M., Basrour, S., Fanget, S., Ancey, P., Devos, A., Defay, E.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Self heating under RF power in BAW SMR and its predictive 1D thermal model
Hassine, N.B., Mercier, D., Renaux, P., Bloch, D., Parat, G., Ivira, B., Waltz, P., Chappaz, C., Fillit, R., Basrour, S.
Published in 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum (01.04.2009)
Published in 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum (01.04.2009)
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Conference Proceeding
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages
FRANK, T, MOREAU, S, CHAPPAZ, C, LEDUC, P, ARNAUD, L, THUAIRE, A, CHERY, E, LORUT, F, ANGHEL, L, POUPON, G
Published in Microelectronics and reliability (2013)
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Published in Microelectronics and reliability (2013)
Journal Article
Through silicon via impact on above BEoL Time Dependent Dielectric Breakdown
Frank, T., Chery, E., Chappaz, C., Arnaud, L., Anghel, L.
Published in 2012 IEEE International Integrated Reliability Workshop Final Report (01.10.2012)
Published in 2012 IEEE International Integrated Reliability Workshop Final Report (01.10.2012)
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Conference Proceeding
Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package
Frank, T., Chappaz, C., Arnaud, L., Federspiel, X., Colella, F., Petitprez, E., Anghel, L.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization
Di Cioccio, Lea, Gueguen, P., Taibi, R., Landru, Didier, Gaudin, G., Chappaz, C., Rieutord, François, De Crecy, F., Radu, Ionut, Chapelon, L., Clavelier, Laurent
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article