Improved performance of aminopropylsilatrane over aminopropyltriethoxysilane as an adhesive film for anchoring gold nanoparticles on silicon surfaces
Hsieh, Shuchen, Chao, Wei-Jay, Hsieh, Chiung-Wen
Published in Journal of nanoscience and nanotechnology (01.05.2009)
Published in Journal of nanoscience and nanotechnology (01.05.2009)
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Journal Article
Molecular orientation and film structure of gramicidin on highly oriented pyrolitic graphite
Hsieh, Shuchen, Chao, Wei-Jay, Hsieh, Chiung-Wen
Published in Journal of colloid and interface science (15.05.2010)
Published in Journal of colloid and interface science (15.05.2010)
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Journal Article
In-line process monitoring of advanced packaging process using Focused Beam Ellipsometry
Huang, Parker, Liu, YiYen, Chao, Jay, Lu, Chun Hung, Chen, Stephen, Chen, Jay, Shen, Fei, Ding, Jian, Mukundhan, Priya, Kryman, Timothy
Published in Microelectronic engineering (02.04.2015)
Published in Microelectronic engineering (02.04.2015)
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Journal Article
Sequence-dependent folding and unfolding of ligand-bound purine riboswitches
Prychyna, Oksana, Dahabieh, Michael S., Chao, Jay, O'Neill, Melanie A.
Published in Biopolymers (01.11.2009)
Published in Biopolymers (01.11.2009)
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Journal Article
Substrate directs enzyme dynamics by bridging distal sites: UDP‐galactopyranose mutase
Yao, Xiaohui, Bleile, Dustin W., Yuan, Yue, Chao, Jay, Sarathy, Karunan P., Sanders, David A. R., Pinto, B. Mario, O'Neill, Melanie A.
Published in Proteins, structure, function, and bioinformatics (01.03.2009)
Published in Proteins, structure, function, and bioinformatics (01.03.2009)
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Journal Article
Laser Direct Structuring of Semiconductor Liquid Encapsulants for Active Mold Packaging
He, Chunlin, DeWit, Ruud, Chao, Jay, Champagne, Tim, Guino, Rose, Winster, Tony, Trichur, Ramachandran, Saliba, Mario, Song, Frank, Roick, Florian, Heitmann, Simon, Roesener, Bernd, Stelling, Johan
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Low -Warpage Encapsulants for Wafer Level Packaging
Chao, Jay, Zhang, Rong, Grimes, David, Shim, Kail, Do, Tu, Ma, Yijia, Trichur, Ramachandran K.
Published in 2020 International Wafer Level Packaging Conference (IWLPC) (13.10.2020)
Published in 2020 International Wafer Level Packaging Conference (IWLPC) (13.10.2020)
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Conference Proceeding
Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer Level Packaging Applications
Chao, Jay, Zhang, Rong, Do, Tu, Tong, AnhBinh, Ma, Yijia, Grimes, David, Trichur, Ramachandran K., Bao, Lirong
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding