Effect of contact metallization on electromigration reliability of Pb-free solder joints
Ding, Min, Wang, Guotao, Chao, Brook, Ho, Paul S., Su, Peng, Uehling, Trent
Published in Journal of applied physics (01.05.2006)
Published in Journal of applied physics (01.05.2006)
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Journal Article
Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints
Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Ding, Min, Im, Jay, Ho, Paul S.
Published in Journal of applied physics (15.10.2006)
Published in Journal of applied physics (15.10.2006)
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Journal Article
Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders
Brook Chao, Seung-Hyun Chae, Xuefeng Zhang, Ho, P.S.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints : RECENT RESEARCH ADVANCES IN Pb-FREE SOLDERS
CHAO, Brook Huang-Lin, XUEFENG ZHANG, CHAE, Seung-Hyun, HO, Paul S
Published in Microelectronics and reliability (2009)
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Published in Microelectronics and reliability (2009)
Journal Article
Electromigration enhanced intermetallic growth and void formationin Pb-free solder joints
Chao, Brook, Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Ding, Min, Im, Jay, Ho, Paul S.
Published in Journal of applied physics (31.10.2006)
Published in Journal of applied physics (31.10.2006)
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Journal Article
A study of electromigration failure in Pb-free solder joints
Min Ding, Guotao Wang, Chao, B., Ho, P.S., Peng Su, Uehling, T., Wontor, D.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints
Seung-Hyun Chae, Chao, B., Xuefeng Zhang, Im, J., Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials
Lu, K.H., Chao, B., Zhiquan Luo, Lijuan Zhang, Hualiang Shi, Jay Im, Ho, P.S., Li Li, Ahmad, M.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding