ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME
CHIANG WEI HAN, CHENG MING DA, SHUE HONG SENG, HSIAO CHING WEN, CHEN CHUN HUNG, CHANG WEI SEN, CHENG CHING HO
Year of Publication 20.05.2022
Get full text
Year of Publication 20.05.2022
Patent
PERIPHERAL ELECTRICAL CONNECTION OF PACKAGE ON PACKAGE
HUANG YU CHIH, HSIAO CHING WEN, LIN CHIH WEI, PAN KUO LUNG, CHANG WEI SEN, HU YEN CHANG
Year of Publication 04.09.2014
Get full text
Year of Publication 04.09.2014
Patent
Dual-sided integrated fan-out package
Kuo, Tin-Hao, Chang, Wei Sen, Pan, Kuo Lung, Tsai, Hao-Yi, Liu, Chung-Shi
Year of Publication 08.12.2020
Get full text
Year of Publication 08.12.2020
Patent