A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Chang, Yuan-Wei, Hu, Chia-chia, Peng, Hsin-Ying, Liang, Yu-Chun, Chen, Chih, Chang, Tao-chih, Zhan, Chau-Jie, Juang, Jing-Ye
Published in Scientific reports (12.04.2018)
Published in Scientific reports (12.04.2018)
Get full text
Journal Article
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration
Chou, Tzu-Chieh, Huang, Shin-Yi, Chen, Pin-Jun, Hu, Han-Wen, Liu, Demin, Chang, Chih-Wei, Ni, Tzu-Hsuan, Chen, Chao-Jung, Lin, Yu-Min, Chang, Tao-Chih, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2021)
Get full text
Journal Article
Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration
Cheng, Hsien-Chie, Cheng, Tzu-Hsuan, Chen, Wen-Hwa, Chang, Tao-Chih, Huang, Hsin-Yi
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2016)
Get full text
Journal Article
3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)
Shen, Wen-Wei, Kao, Ming-Jer, Chen, Kuan-Neng, Lin, Yu-Min, Chen, Shang-Chun, Chang, Hsiang-Hung, Chang, Tao-Chih, Lo, Wei-Chung, Lin, Chien-Chung, Chou, Yung-Fa, Kwai, Ding-Ming
Published in IEEE journal of the Electron Devices Society (01.01.2018)
Published in IEEE journal of the Electron Devices Society (01.01.2018)
Get full text
Journal Article
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
CHANG, Jing-Yao, CHENG, Ren-Shin, KAO, Kuo-Shu, CHANG, Tao-Chih, CHUANG, Tung-Han
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
Get full text
Journal Article
Low temperature Ag-Ag direct bonding under air atmosphere
Chang, Leh-Ping, Huang, Shin-Yi, Chang, Tao-Chih, Ouyang, Fan-Yi
Published in Journal of alloys and compounds (05.05.2021)
Published in Journal of alloys and compounds (05.05.2021)
Get full text
Journal Article
Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards
Lin, Ching-Tsung, Hsi, Chi-Shiung, Wang, Moo-Chin, Chang, Tao-Chih, Liang, Ming-Kann
Published in Journal of alloys and compounds (14.07.2008)
Published in Journal of alloys and compounds (14.07.2008)
Get full text
Journal Article
Development of Cu-Ag pastes for high temperature sustainable bonding
Hsiao, Ching-Huan, Kung, Wan-Ting, Song, Jenn-Ming, Chang, Jing-Yao, Chang, Tao-Chih
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (27.01.2017)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (27.01.2017)
Get full text
Journal Article
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
Ching-Kuan Lee, Tao-Chih Chang, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Lo, R., Ming-Jer Kao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
Get full text
Journal Article
Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test
Lee, Chang-Chun, Lin, Yu-Min, Liu, Hou-Chun, Syu, Ji-Yuan, Huang, Yuan-Cheng, Chang, Tao-Chih
Published in Microelectronic engineering (01.05.2021)
Published in Microelectronic engineering (01.05.2021)
Get full text
Journal Article
Evaluation of Various Surface Finished Halogen-Free Printed Circuit Board Assembly Under Four-Point Bending Test
CHANG, Hung-Jen, CHANG, Tao-Chih, ZHAN, Chau-Jie, CHOU, Jung-Hua
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Get full text
Journal Article
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
Hsi, Chi-Shiung, Lin, Ching-Tsung, Chang, Tao-Chih, Wang, Moo-Chin, Liang, Ming-Kann
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.02.2010)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.02.2010)
Get full text
Journal Article
Influence of underfill materials on the reliability of coreless flip chip package
Chuang, Chun-Chih, Yang, Tsung-Fu, Juang, Jin-Ye, Hung, Yin-Po, Zhan, Chau-Jie, Lin, Yu-Min, Lin, Ching-Tsung, Chang, Pei-Chen, Chang, Tao-Chih
Published in Microelectronics and reliability (01.11.2008)
Published in Microelectronics and reliability (01.11.2008)
Get full text
Journal Article
Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn– xAg/Cu substrates
Chang, Tao-Chih, Wang, Moo-Chin, Hon, Min-Hsiung
Published in Journal of crystal growth (01.03.2003)
Published in Journal of crystal growth (01.03.2003)
Get full text
Journal Article