Investigation of BEOL plasma process induced damage effect on gate oxide
Lingxiao Cheng, Xiaofeng Xu, Wu, Chi-Hsi Jeff, Chang, Jung-Che Venson
Published in 2015 Annual Reliability and Maintainability Symposium (RAMS) (01.01.2015)
Published in 2015 Annual Reliability and Maintainability Symposium (RAMS) (01.01.2015)
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Conference Proceeding
Mechanism exploration on Cu interconnect negative resistance shift during stress migration
XiangFu Zhao, Dulin Wang, Gan, Howard, Zheng, Kevin, Wu, Jeff, Chang, Venson, Chien, Wei-Ting Kary
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
Published in 2014 IEEE International Reliability Physics Symposium (01.06.2014)
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Conference Proceeding
The Impact of Different Stress Condition Combinations on Parameters Estimations in Electromigration Tests
Ma, Jinyi J., Wang, Xiaotao J., Gong, Excimer B., Chang, Venson
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Early failure model analysis and improvement of the upstream electromigration in 45nm Cu low-k interconnects
Wang, D., Zhao, A. Y., Yu, L., Wu, J., Chang, V., Chien, Wei-Ting Kary
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
Ag Migration Induced Reliability Concern on Micro-Electro-Mechanical Structure
Zheng, Pengfei, Dong, Weichun, Chang, Venson, Liu, Yunhai, Li, Gang, Ji, Chunkui, Li, Ming
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
The worst stress condition of hot carrier degradation on high voltage LDMOSFET
Huayang, Sarah Zhou, Yongliang Song, Zhuo Song, Yanju, Lisa Yu, Yong, Atman Zhao, Wu, Jeff, Chang, Venson, Chien, Kary
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding
Optimization of TEM sample preparation methods by FIB for the increase of throughput
Shuqing Duan, Chien, Kary, Ruijuan Qi, Ming Li, Yanli Zhao, Liu Chen, Qinqin Yu, Guo, Annie, Chang, Venson, Wu, Jeff
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding