Characteristic study of anisotropic-conductive film for chip-on-film packaging
Chang, Shyh-Ming, Jou, Jwo-Huei, Hsieh, Adam, Chen, Tai-Hong, Chang, Ching-Yun, Wang, Yung-Hao, Huang, Chun-Ming
Published in Microelectronics and reliability (01.12.2001)
Published in Microelectronics and reliability (01.12.2001)
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Journal Article
Process-dependent contact characteristics of NCA assemblies
Cheng, H.-C., Ho, C.-L., Chiang, K.-N., Chang, S.-M.
Published in IEEE transactions on components and packaging technologies (01.06.2004)
Published in IEEE transactions on components and packaging technologies (01.06.2004)
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Journal Article
Electrical characterization of fine-pitch compliant bumps
Lin, C.K., Chih Chen, Shyh-Ming Chang, Chao-Chyun An, Hsiao Ting Lee, Kuo-Shu Kao, Jimmy Tsang, Sheng-Shu Yang
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Electrical characterization of fine-pitch compliant bumps
Lin, C.K., Chih Chen, Shyh-Ming Chang, Chao-Chyun An, Hsiao Ting Lee, Kuo-Shu Kao, Jimmy Tsang, Sheng-Shu Yang
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"
Ming-Yao Chen, Chao-Chyun An, Shyh-Ming Chang, Kuo-Shu Kao, Tsang, J., Sheng-Shu Yang, Chih Chen, Chung-Kuang Lin
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Fine pitch "NCF-type compliant-bumped COG"
Chao-Chyun An, Shyh-Ming Chang, Ming-Yao Chen, Kuo-Shu Kao, Jimmy Tsang, Sheng-Shu Yang, Chih Chen, Chung-Kuang Lin, Ren-Haw Chen, Wen-Chih Chen
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads
Tsai, M.Y., Huang, C.Y., Ting, C.W., Kuo-Shu Kao, Ming-Yao Chen
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding