Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
CHANG, Jing-Yao, CHENG, Ren-Shin, KAO, Kuo-Shu, CHANG, Tao-Chih, CHUANG, Tung-Han
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2012)
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Journal Article
Development of Cu-Ag pastes for high temperature sustainable bonding
Hsiao, Ching-Huan, Kung, Wan-Ting, Song, Jenn-Ming, Chang, Jing-Yao, Chang, Tao-Chih
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (27.01.2017)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (27.01.2017)
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Journal Article
Investigation of pre-bending substrate design in packaging assembly of an IGBT power module
Lee, Chang-Chun, Kao, Kuo-Shu, Lin, Leon, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Chang, Tao-Chih
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
Development of packaging technologies for SiC power module
Chun-Kai Liu, Yu-Lin Chao, Wei Li, Chih-Ming Tzeng, Kuo-Shu Kao, Jing-Yao Chang, Rong-Chang Fang
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology
Jing-Yao Chang, Su-Yu Fun, Fang-Jun Leu, Kuo-Shu Kao, Chih-Ming Tzeng, Wei-Kuo Han, Tao-Chih Chang
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
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Conference Proceeding
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
Chau-Jie Zhan, Pei-Jer Tzeng, Lau, J. H., Ming-Ji Dai, Heng-Chieh Chien, Ching-Kuan Lee, Shang-Tsai Wu, Kuo-Shu Kao, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Yu-Min Lin, Jing-Yao Chang, Tsung-Fu Yang, Tai-Hung Chen, Lo, R., Kao, M. J.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
The first MIT 600 V/450 a IGBT module for EV/HEV applications
Kuo-Shu Kao, Fang-Jun Leu, Jing-Yao Chang, Su-Yu Fan, Yu-Lan Lu, Tao-Chih Chang
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections
Shin-Yi Huang, Chau-Jie Zhan, Yu-Wei Huang, Yu-Min Lin, Chia-Wen Fan, Su-Ching Chung, Kuo-Shu Kao, Jing-Yao Chang, Mei-Lun Wu, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture
Shin-Yi Huang, Tao-Chih Chang, Ren-Shin Cheng, Jing-Yao Chang, Chia-Wen Fan, Chau-Jie Zhan, Lau, J. H., Tai-Hong Chen, Wei-Chung Lo, Ming-Jer Kao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Achievement of low temperature chip stacking by a wafer-applied underfill material
Ren-Shin Cheng, Kuo-Shu Kao, Jing-Yao Chang, Yin-Po Hung, Tsung-Fu Yang, Yu-Wei Huang, Su-Mei Chen, Tao-Chih Chang, Qiaohong Huang, Guino, R., Hoang, G., Jie Bai, Becker, K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections
Yu-Min Lin, Chau-Jie Zhan, Kuo-Shu Kao, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Shin-Yi Huang, Jing-Yao Chang, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Stacking of ultra-thin film packages
Cheng-Ta Ko, Ying-Ching Shih, Jing-Yao Chang, Tzu-Ying Kuo, Yu-Hua Chen, Ostmann, A., Manessis, D.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Manufacturing and stacking of ultra-thin film packages
Ying-Ching Shih, Tzu-Ying Kuo, Yin-Po Hung, Jing-Yao Chang, Chih-Yuan Cheng, Kuo-Chyuan Chen, Ching-Kuan Lee, Chao-Kai Hsu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Cheng-Ta Ko, Yu-Hua Chen
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Ternary lead-free SnAgCu micro-bumps for ultra-fine pitch chip-to-chip interconnection
Tsung-Fu Tsai, Jing-Yao Chang, Chien-Wei Chien, Jing-Ye Juang, Li-Cheng Shen
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding