Ultrathin New Dielectric Interlayer Layer - Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications
Cheemalamarri, Hemanth Kumar, Lee Hou Jang, Steven, Miao, Ji Hong, V, Nandini, S, Chandra Rao B S, King Jien, Chui, Rao, Vempati Srinivasa, Singh, Navab
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Get full text
Conference Proceeding
Wear behaviour of AE42+20% saffil Mg-MMC
Kumar Mondal, Ashok, Chandra Rao, B.S.S., Kumar, Subodh
Published in Tribology international (01.02.2007)
Published in Tribology international (01.02.2007)
Get full text
Journal Article
Conference Proceeding
Under-Bump Metallization Contact Resistance ( R ) Characterization at 10- \mu \text Polymer Passivation Opening
Lianto, Prayudi, King-Jien Chui, Bhushan, Bharat, Chua, H. M. Calvin, Leijun Tang, Chandra Rao, B. S. S., Xin Wang, Ai Long Wu, Yu Gu, Guan Huei See, Sundarrajan, Arvind
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Get full text
Journal Article
Structural, thermal, electromechanical and mechanical property studies on (Pb0.93La0.07)(Zr0.60Ti0.40)O3 ceramics synthesized by a high energy mechanochemical milling process
James, A R, Chandra Rao, B S S, Kamat, S V, Subrahmanyam, J, Srinivas, K, Thakur, O P
Published in Smart materials and structures (01.06.2008)
Published in Smart materials and structures (01.06.2008)
Get full text
Journal Article
Wafer Stacked Wide I/O DRAM with One-step TSV Technology
Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin, Loh, Woon-Leng, Chandra Rao, B. S. S., Chui, King-Jien, Kawagoe, Tsuyoshi, Homma, Ichiro
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Effect of Temperature on Fracture Toughness of Timetal 834 Titanium Alloy under Mode I and Mixed Mode I/III Loading
Chandra Rao, B.S.S., Srinivas, M., Kamat, S.V.
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2008)
Published in Metallurgical and materials transactions. A, Physical metallurgy and materials science (01.06.2008)
Get full text
Journal Article
Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites
Niranjani, V.L., Rao, B.S.S. Chandra, Singh, Vajinder, Kamat, S.V.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.11.2011)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.11.2011)
Get full text
Journal Article
Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y.
Published in Microelectronic engineering (01.11.2010)
Published in Microelectronic engineering (01.11.2010)
Get full text
Journal Article
Effect of Gold Addition on the Microstructure and Mechanical Properties of Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy
Niranjani, V. L., Venkateswarlu, Pamidi, Singh, Vajinder, Chandra Rao, B. S. S., Kamat, S. V.
Published in Transactions of the Indian Institute of Metals (01.06.2018)
Published in Transactions of the Indian Institute of Metals (01.06.2018)
Get full text
Journal Article
The effect of volume fraction of primary α phase on fracture toughness behaviour of Timetal 834 titanium alloy under mode I and mixed mode I/III loading
Rao, B.S.S. Chandra, Srinivas, M., Kamat, S.V.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.09.2009)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.09.2009)
Get full text
Journal Article
Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
Rao, B.S.S. Chandra, Kumar, K. Mohan, Kripesh, V., Zeng, K.Y.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.05.2011)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.05.2011)
Get full text
Journal Article
Structural, thermal, electromechanical and mechanical property studies on (Pb 0.93 La 0.07 )(Zr 0.60 Ti 0.40 )O 3 ceramics synthesized by a high energy mechanochemical milling process
James, A R, Chandra Rao, B S S, Kamat, S V, Subrahmanyam, J, Srinivas, K, Thakur, O P
Published in Smart materials and structures (01.06.2008)
Published in Smart materials and structures (01.06.2008)
Get full text
Journal Article
Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Preparation and Characterization of PZT Wafers
Seal, A, Rao, B S S Chandra, Kamath, S V, Sen, A, Maiti, H S
Published in Smart Devices: Modeling of Material Systems (AIP Conference Proceedings Volume 1029) (01.01.2008)
Published in Smart Devices: Modeling of Material Systems (AIP Conference Proceedings Volume 1029) (01.01.2008)
Get full text
Journal Article
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints
Rao, B S S Chandra, Fernandez, D M, Kripesh, V, Zeng, K Y
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Get full text
Conference Proceeding